Embedded Thin-Film Magnetic Inductor for IVR Parasitic Reduction
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Solution Overview
Problem
Conventional air core inductors in integrated voltage regulator (IVR) applications face scaling issues due to low inductance and are often far from the IVR, leading to parasitic inductance and increased space occupancy.
Innovation Solution
An embedded thin-film magnetic inductor design utilizing solder features like microbumps or C4 bumps to reduce size and increase inductance, with the inductor formed by a magnetic material disposed between solder features electrically coupled by a metal layer, allowing it to be closer to the IVR and reducing parasitic inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional air core inductors are used in IVR applications, then the inductor structure is simple and easy to manufacture, but the inductance value is low and the inductor occupies more space
Solution Approach 1:
The patent introduces magnetic material layers (e.g., permalloy, nickel-iron alloy) into the inductor structure, combining non-magnetic interposer materials with magnetic materials to form a composite inductor. This composite structure significantly increases the inductance value compared to conventional air core inductors, thereby reducing the space required for the inductor while maintaining manufacturing feasibility through standard semiconductor fabrication processes
Solution Approach 2:
The patent transitions from a planar air core inductor design to a three-dimensional embedded inductor structure by stacking multiple magnetic material layers at different heights and positions within the interposer. This dimensional transformation enables higher inductance density and more efficient space utilization without compromising manufacturing ease
2Ease of manufacture
If conventional air core inductors are positioned far from the IVR, then the inductor can be easily integrated into the package, but parasitic inductance increases and system efficiency decreases
Solution Approach 1:
The patent merges the inductor structure with the interposer substrate, embedding the inductor directly within the interposer material matrix. This integration eliminates the need for separate inductor components and long interconnection traces, thereby reducing parasitic inductance while maintaining ease of integration into the overall package structure
Solution Approach 2:
The interposer serves as an intermediary medium that hosts the embedded inductor structure. By using the interposer material as both the substrate and the inductor former, the patent reduces the distance between the IVR and the inductor, minimizing parasitic effects while preserving integration simplicity
3Object-generated harmful factors
If the inductor is moved closer to the IVR, then parasitic inductance is reduced and efficiency improves, but the inductor design becomes more complex
Solution Approach 1:
The patent divides the inductor into multiple segments or layers, with different magnetic material layers positioned at various heights and locations within the interposer. This segmentation allows the inductor to be placed close to the IVR for reduced parasitic effects while managing design complexity through modular layer construction that can be fabricated using standard semiconductor processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thin-film magnetic inductor provides higher inductance than conventional air core inductors, reduces parasitic inductance and resistance, and occupies less space, enhancing the efficiency and compactness of IVR systems.
Implementation Method 1
an inductor formed by a magnetic material disposed between two of the solder features electrically coupled to each other by a portion of the metal layer of the interposer, the inductor electrically coupled to the integrated voltage regulator
Data Source
AI summary
A package including a package substrate; an interposer electrically coupled to the package substrate and including a metal layer; a die including an integrated voltage regulator and electrically coupled to the interposer by solder features; and an inductor formed by a magnetic material disposed between two of the solder features electrically coupled to each other by a portion of the metal layer of the interposer, the inductor electrically coupled to the integrated voltage regulator.