Embedded Magnetic Inductor Substrates With Lower Signal Interference
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Solution Overview
Problem
In microelectronic packaging, inductor structures face efficiency issues due to magnetic material interference with signal integrity, affecting power delivery requirements as the magnetic material can hinder input/output density, z-height reduction, and form factor minimization.
Innovation Solution
The selective embedding of magnetic materials within specific locations of microelectronic package substrates using techniques like stencil printing, grinding, and plasma etching to form embedded inductor structures, allowing for precise placement and minimizing surface coverage, thus avoiding interference with signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If magnetic material is used in inductor structures, then power delivery requirements are met, but signal integrity is interfered with due to conductive fillers in the magnetic material
Solution Approach 1:
The patent extracts and removes the harmful conductive fillers from the magnetic material while retaining the beneficial magnetic properties. This is achieved by selecting magnetic materials that are inherently free of conductive fillers, thereby eliminating the source of signal interference while maintaining power delivery functionality.
Solution Approach 2:
The patent applies different material qualities to different regions: the magnetic material is used where magnetic properties are needed for power delivery, while conductive fillers are excluded from regions where signal integrity is critical. This spatial differentiation of material properties resolves the contradiction between power delivery and signal integrity.
2Power
If inductor structures are added to meet power delivery requirements, then power delivery efficiency improves, but device complexity increases
Solution Approach 1:
The patent merges the inductor structure with the existing substrate by embedding the magnetic material directly into the substrate layers. This integration eliminates the need for separate external inductor components, thereby improving power delivery efficiency while avoiding increased device complexity.
Solution Approach 2:
The substrate is designed to serve multiple functions: it provides mechanical support, electrical interconnection, and hosts the magnetic inductor structure for power delivery. This multi-functionality reduces the need for additional dedicated components, thus improving power delivery without proportionally increasing complexity.
3Device complexity
If magnetic material is embedded in substrate, then external inductors are eliminated, but manufacturing precision requirements increase
Solution Approach 1:
The patent performs preliminary actions by forming cavities and preparing substrate layers before embedding the magnetic material. This advance preparation ensures that the magnetic material can be precisely positioned and embedded without requiring excessive precision during the final embedding step, thereby reducing overall manufacturing precision requirements.
Solution Approach 2:
The patent modifies manufacturing parameters such as cavity dimensions, magnetic material thickness, and embedding depth to optimize the embedding process. By carefully controlling these parameters, the patent achieves precise embedding while maintaining reasonable manufacturing precision requirements that can be met with standard fabrication capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances power delivery efficiency by integrating magnetic inductors within the substrate, reducing the need for external inductors and minimizing signal interference, while allowing for increased input/output density and reduced form factor.
Implementation Method 1
magnetic material of such inductor structures can interfere with signal integrity
Implementation Method 2
conductive fillers present in the magnetic material
Data Source
AI summary
Methods/structures of forming embedded inductor structures are described. Embodiments include forming a first interconnect structure on a dielectric material of a substrate, selectively forming a magnetic material on a surface of the first interconnect structure, forming an opening in the magnetic material, and forming a second interconnect structure in the opening. Build up layers are then formed on the magnetic material.