Embedded Magnetic Inductors in EMIB Bridge Substrates
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Solution Overview
Problem
The miniaturization of semiconductor device packaging poses challenges in developing compact power-delivery solutions, as existing inductors struggle to constrain size while maintaining effective magnetic permeability and electrical insulation.
Innovation Solution
The integration of magnetic-core inductors within cavities of embedded multi-die interconnect bridges (EMIBs) using laser-drilling and ferrite magnetic material, which provides permeability beyond unity and efficient electrical insulation through a dielectric buffer, allowing for reduced lateral and Z-size dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If existing inductors are used for power delivery in semiconductor packaging, then power delivery function is provided, but size constraints cannot be met and magnetic permeability is insufficient
Solution Approach 1:
The inductor is nested within the EMIB cavity structure, utilizing the existing three-dimensional space. The coil is formed in the substrate, covered with dielectric material, and the EMIB cavity is then formed around it, effectively nesting the inductor within the package substrate to reduce overall size while maintaining magnetic properties.
Solution Approach 2:
The inductor employs a composite structure combining conductive coil material (such as copper or aluminum), dielectric buffer material (for insulation), and magnetic core material (such as ferrite). This composite approach enables simultaneous achievement of compact size, electrical insulation, and enhanced magnetic permeability beyond unity.
2Volume of moving object
If inductor size is reduced to meet miniaturization requirements, then lateral and Z-size dimensions are constrained, but electrical insulation becomes compromised
Solution Approach 1:
A dielectric buffer material is introduced as an intermediary between the conductive coil and surrounding structures. This dielectric layer provides essential electrical insulation while allowing the inductor to be miniaturized. The buffer material fills spaces and prevents electrical shorting despite reduced dimensions.
3Reliability
If magnetic permeability is increased to improve power delivery efficiency, then device complexity increases
Solution Approach 1:
The magnetic permeability is enhanced by changing the physical parameters of the inductor structure - specifically by introducing magnetic core material with permeability beyond unity and optimizing the coil geometry within the EMIB cavity. This achieves improved magnetic properties through parameter optimization rather than structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of compact power-delivery solutions with enhanced magnetic permeability and electrical insulation, effectively addressing the size constraints and insulation needs in semiconductor device packaging.
Implementation Method 1
magnetic material in interstices of the inductor coil... achieve permeability beyond unity
Implementation Method 2
efficient electrical insulation through a dielectric buffer
Implementation Method 3
laser-drilling
Data Source
AI summary
An embedded magnetic inductor coil is at least partially exposed in a recess that seats an embedded multi-chip interconnect bridge die on the coil. The embedded multi-chip interconnect bridge die provides a communications bridge between a dominant semiconductive device and a first semiconductive device.