Embedded Magnetic Inductors in IC Substrates
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Solution Overview
Problem
Current integrated circuit (IC) package power delivery systems face challenges in achieving high switching speeds and efficient power distribution due to limitations in inductor placement and integration, particularly in small form factor designs, where stand-alone discrete inductors or air-core inductors on substrates fall short in performance.
Innovation Solution
The integration of an organic magnetic film within the substrate of IC packages, either as a cored or coreless substrate, allows for the embedding of planar magnetic structures close to the land side, enabling improved power delivery performance by optimizing inductor placement and architecture, including the use of magnetic particles in a polymer matrix and non-lithographic patterning methods for flexible and efficient inductor core formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If stand-alone discrete inductors are attached on the land side of the package, then inductor functionality is achieved, but power delivery performance is insufficient and footprint is large
Solution Approach 1:
The patent merges the inductor functionality with the substrate structure by embedding magnetic material directly into the substrate layers. This integration combines what were previously separate components (discrete inductor and substrate) into a unified structure, achieving superior power delivery performance while reducing the overall footprint by eliminating the need for separate inductor components and their associated mounting space
Solution Approach 2:
The patent transitions from planar placement of discrete inductors on the substrate surface to three-dimensional embedding of magnetic material within the substrate layers. This dimensional change allows inductors to be positioned closer to the core and enables more efficient use of vertical space, thereby improving power delivery performance without increasing the lateral footprint
2Reliability
If air-core inductors are integrated on the substrate, then inductor functionality is achieved, but power delivery performance is insufficient compared to embedded magnetic inductors
Solution Approach 1:
The patent changes the magnetic permeability parameter by introducing magnetic material into the substrate, transforming air-core inductors into magnetic-core inductors. This parameter change significantly enhances the inductance value and power delivery performance. The process integrates this transformation into existing substrate fabrication steps, managing the added complexity through process integration rather than introducing entirely new manufacturing steps
Solution Approach 2:
The patent employs composite materials by combining magnetic particles with polymer matrix or integrating magnetic layers with dielectric layers in the substrate. This composite approach enables the substrate to simultaneously provide structural support, electrical insulation, and magnetic functionality, thereby improving power delivery performance while managing device complexity through material integration rather than structural complexity
3Reliability
If inductors are embedded close to the core on the land side, then superior power delivery performance is achieved, but manufacturing process complexity increases
Solution Approach 1:
The patent applies preliminary action by incorporating magnetic material into the substrate during the early stages of substrate fabrication, before final assembly. This allows inductors to be pre-formed and positioned close to the core in the desired locations, enabling superior power delivery performance while simplifying the overall manufacturing process by integrating inductor formation into existing fabrication steps rather than adding post-assembly operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances power delivery performance by allowing for asymmetric package architectures with integrated inductors closer to the land side, improving the efficiency and flexibility of power distribution in IC packages, particularly for voltage regulators, without requiring significant modifications to conventional assembly processes.
Implementation Method 1
laminating a magnetic film over the substrate, wherein the magnetic film has an interface with the one or more islands of the anti-adhesion film, the metal structures and the dielectric
Data Source
AI summary
A substrate for an integrated circuit package, the substrate comprising a dielectric, at least one conductor plane within the dielectric, and a planar magnetic structure comprising an organic magnetic laminate embedded within the dielectric, wherein the planar magnetic structure is integrated within the at least one conductor plane.