Embedded Magnetic Inlay Geometry for Higher Inductance Carriers
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Solution Overview
Problem
Conventional component carriers face challenges in providing high inductance values while maintaining mechanical robustness, electrical reliability, and cost-efficiency, particularly in the context of miniaturized and densely packed electronic components.
Innovation Solution
A magnetic inlay is designed with a magnetic matrix and embedded electrically conductive structures, allowing for adjustable inductance values through geometric parameters such as thickness and shape, which can be easily integrated into component carriers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional approaches are used to integrate magnetic material in a component carrier, then magnetic functionality is provided, but inductance values are low and production costs are high
Solution Approach 1:
The patent employs composite structures combining magnetic materials with electrically conductive materials (such as copper foils or traces) embedded within the magnetic matrix. This composite approach enables the achievement of high inductance values by utilizing both the magnetic properties of the magnetic material and the electrical conductivity of the embedded structures, while maintaining cost-effectiveness through the use of standard manufacturing techniques for creating such composites
Solution Approach 2:
The patent transitions from conventional planar or surface-mounted magnetic components to three-dimensional embedded structures where electrically conductive elements are integrated within the magnetic material volume. This dimensional change allows for increased inductance density by utilizing the internal volume of the magnetic inlay rather than just the surface area, thereby achieving higher inductance values without proportionally increasing the footprint or material cost
2Reliability
If magnetic material is integrated to provide high inductance, then inductance value increases, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The magnetic inlay is divided into distinct functional segments: magnetic material portions providing magnetic flux paths and electrically conductive portions providing current paths. This segmentation allows each segment to be optimized independently and manufactured using specialized processes, then combined through standard lamination and structuring techniques, thereby reducing overall manufacturing complexity while achieving high inductance values
Solution Approach 2:
The electrically conductive structures embedded in the magnetic inlay serve multiple functions simultaneously: they act as current-carrying traces, provide structural support within the magnetic matrix, and enable magnetic coupling between different layers. This multi-functionality reduces the need for separate components and simplifies the overall device architecture, lowering manufacturing complexity while maintaining high inductance performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The magnetic inlay provides high inductance values in a flexible and cost-effective manner, enhancing the functionality of component carriers while ensuring mechanical robustness and electrical connectivity.
Implementation Method 1
the electrically conductive structure is configured as an inductive element (e.g., shaped as windings and/or coil)
Implementation Method 2
a magnetic matrix (e.g., a magnetic sheet), and at least one (in particular two or more) electrically conductive structure (e.g., a copper trace) embedded (horizontally (i.e., (essentially) parallel with the directions of main extension of the magnetic inlay)) in the magnetic matrix
Data Source
AI summary
A magnetic inlay for a component carrier includes a magnetic matrix and an electrically conductive structure embedded horizontally in the magnetic matrix. The electrically conductive structure is configured as an inductive element. The magnetic inlay is configured so that, depending on the geometrical properties of the electrically conductive structure, a specific inductance value is provided for the magnetic inlay.