Embedded Magnetic Core Windings for Low-Leakage Isolation
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Solution Overview
Problem
Existing power supply devices face challenges in miniaturization and cost reduction due to the size and weight of magnetic components, with issues such as air bubble formation, isolation distance requirements, and high leakage inductance affecting performance and safety.
Innovation Solution
The design incorporates multilayer windings around a magnetic core with improved coupling and reduced leakage inductance, using insulating substrates with specific trace and via configurations to minimize physical size and enhance electrical isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy gel is used to fill the cavity around the magnetic core, then the magnetic core is fully covered and secured, but air bubbles form in the epoxy gel during solidification which can expand during reflow soldering and cause device failure
Solution Approach 1:
The patent removes the harmful epoxy gel filling from the cavity, extracting the problematic element that causes air bubble formation. Instead of filling the cavity with epoxy gel, the design uses a different approach where the magnetic core is secured through mechanical means or alternative methods that do not involve liquid filling, thereby eliminating the source of air bubble contamination.
Solution Approach 2:
The patent introduces an intermediary substance or method to secure the magnetic core without using epoxy gel. This could involve using a different bonding material, mechanical fixation structures, or a filling process that prevents air bubble entrapment, serving as a mediator between the magnetic core and the cavity walls without introducing harmful air bubbles.
2Ease of manufacture
If through-holes are drilled and plated to form vias for windings, then electrical connections are established, but the isolation distance between primary and secondary windings increases device size
Solution Approach 1:
The patent utilizes multiple layers or levels in the substrate to route windings, allowing primary and secondary windings to be separated in the vertical dimension rather than requiring large horizontal spacing. By stacking vias and traces across multiple layers with appropriate insulation, the design achieves electrical isolation while maintaining a compact footprint.
Solution Approach 2:
The patent employs nested via structures where vias are positioned concentrically or in closely spaced patterns around the magnetic core, allowing multiple electrical connections to be made in a compact arrangement. The windings are configured to share common via locations or to be tightly coupled around the core, reducing the overall device area while maintaining necessary isolation.
3Weight of stationary object
If magnetic components are made larger to reduce weight density, then the power supply device size increases, making miniaturization difficult
Solution Approach 1:
The patent uses composite magnetic materials or structures that achieve high magnetic performance with reduced volume. This may involve using ferrite-composite materials, nanocrystalline alloys, or optimized magnetic core geometries that provide the necessary magnetic properties in a smaller package, thereby reducing both weight and volume of the power supply device.
Solution Approach 2:
The patent transitions from traditional large-volume magnetic components to compact embedded structures by utilizing three-dimensional winding arrangements around the magnetic core. The multilayer winding configuration allows for efficient use of space, achieving the required inductance and power handling in a smaller overall volume while maintaining appropriate weight characteristics.
4Use of energy by moving object
If multilayer windings are implemented with traces on both sides of the substrate, then power transfer efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent designs the substrate and winding structure to serve multiple functions simultaneously. The same via structures and trace patterns used for electrical connections also serve as the winding paths, eliminating the need for separate winding processes. The multilayer configuration provides both power transfer and isolation functions through integrated design, reducing overall manufacturing complexity despite the multilayer architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves compact power supply devices with enhanced electrical performance, reduced leakage inductance, and improved safety characteristics, meeting insulation requirements while maintaining efficient power transfer.
Implementation Method 1
a first electrical winding that extends through the insulating substrate and around the magnetic core; and a second electrical winding that extends through the insulating substrate and around the magnetic core
Data Source
AI summary
A device includes a substrate; a magnetic core in the substrate and including a hole; a first winding extending through the hole and around the magnetic core; and a second winding extending through the hole, around the magnetic core, and around a portion of the first winding. The first and the second windings only extend around the same half of the magnetic core.