Embedded Magnetic Printed Circuit Board Inductor for High Frequency Power Efficiency
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Solution Overview
Problem
Existing printed circuit boards face challenges in maintaining high permeability at high frequencies, increasing inductance while reducing DC resistance, and enhancing design freedom for coil pattern formation, especially in power management integrated circuits (PMICs) where high-frequency power supply switching is required.
Innovation Solution
A multilayer printed circuit board design incorporating a core structure with embedded magnetic members and coil patterns, where magnetic members are placed in recesses of core layers and insulating layers are used to reduce DC resistance and increase inductance, allowing for high-frequency operation and improved design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If the PMIC power supply switching frequency is increased to improve power efficiency, then power efficiency is improved, but maintaining high permeability at high frequency becomes difficult
Solution Approach 1:
The patent uses a composite structure combining magnetic members (ferrite or nickel-zinc ferrite) embedded in the core layers with copper coil patterns formed on the surface. This composite material approach allows the inductor to maintain high permeability at high frequencies while achieving the required inductance value for improved power efficiency in PMIC applications.
Solution Approach 2:
The patent applies different materials and structures to different regions: magnetic members are embedded only in specific core layers where high permeability is needed, while coil patterns are formed on surface layers for electrical connectivity. This local differentiation allows the inductor to maintain high permeability at high frequencies while achieving the required inductance value.
2Use of energy by moving object
If inductance is increased to improve power efficiency, then inductance is improved, but DC resistance increases as a side effect
Solution Approach 1:
The patent transitions from planar coil patterns to three-dimensional embedded magnetic members within multilayer core structures. By utilizing the vertical dimension and embedding magnetic materials in core layers, the inductor achieves higher inductance density without proportionally increasing the DC resistance of the coil paths.
Solution Approach 2:
The combination of magnetic members with high permeability and copper coil patterns creates a composite inductor structure that achieves high inductance values while maintaining low DC resistance, thereby improving power efficiency by reducing energy losses.
3Adaptability or versatility
If coil pattern design freedom is increased to improve adaptability, then design freedom is improved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the inductor structure into separate functional segments: magnetic members embedded in core layers, insulating layers for electrical isolation, and coil patterns formed on surface layers. This segmentation allows independent optimization of each component and simplifies the manufacturing process while maintaining design flexibility for different inductance values and configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution maintains high permeability at high frequencies, reduces DC resistance, and increases design freedom for coil pattern formation, enhancing inductance performance and power efficiency in PMICs.
Implementation Method 1
a first magnetic member disposed in the first recess and including a first magnetic layer
Implementation Method 2
one or more coil patterns may be formed in the core structure to correspond to the one or more magnetic members
Data Source
AI summary
A printed circuit board includes a first core layer having a first coil pattern disposed on one surface of the first core layer, a second core layer disposed on the one surface of the first core layer and having a first recess, a first magnetic member disposed in the first recess and including a first magnetic layer, a first insulating layer disposed between the first and second core layers, and a second insulating layer disposed on the second core layer, covering at least a portion of the first magnetic member, and disposed in at least a portion of the first recess.