Embedded Magnetic Components in PCB Substrates for High-Density Packaging
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Solution Overview
Problem
The integration of magnetic components into standard semiconductor packages is limited by their size and mechanical complexity, hindering miniaturization and integration with active and passive components, which restricts higher circuit density and power performance.
Innovation Solution
A printed circuit board (PCB) substrate design that embeds magnetic components, such as U-cores and E-cores, with vertically extending posts and a top plate, allowing for embedding and encapsulation within the PCB substrate, along with the use of thermal pre-pregs and conductive traces for windings, enabling compact and high-density packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If magnetic components are integrated into standard semiconductor packages, then circuit density and power performance are improved, but the size and mechanical complexity of magnetic components prevent full integration
Solution Approach 1:
The patent merges the magnetic component with the PCB substrate by embedding the magnetic core directly into the substrate layers. The magnetic core is positioned between PCB layers and encapsulated with pre-preg material, combining what were previously separate components (magnetic component and PCB) into a single integrated structure. This eliminates the need for separate mounting of magnetic components and reduces mechanical complexity.
Solution Approach 2:
The magnetic core is nested within the PCB substrate structure. The core is placed between PCB layers and surrounded by pre-preg material during lamination, creating a nested configuration where the magnetic component is embedded within the substrate. This nesting approach allows the magnetic component to occupy space within the existing PCB structure rather than adding external bulk.
2Volume of moving object
If magnetic components are made smaller to enable integration, then package size is reduced, but manufacturing complexity increases
Solution Approach 1:
The magnetic core is positioned and prepared before the final PCB lamination process. Holes are drilled and prepared in the PCB layers to receive the core, and the core is placed in position before the pre-preg material is applied and cured. This preliminary positioning ensures proper alignment and integration without requiring complex post-assembly operations.
Solution Approach 2:
The pre-preg material serves multiple functions simultaneously: it acts as an adhesive to bond PCB layers, provides encapsulation for the magnetic core, and fills gaps around the core during lamination. This self-service approach eliminates the need for separate adhesive application and encapsulation steps, simplifying the manufacturing process despite the integrated design.
3Device complexity
If magnetic components are embedded in PCB substrate, then component size and complexity are reduced, but embedding and encapsulation processes are required
Solution Approach 1:
The embedding and encapsulation operations are merged into the standard PCB lamination process. The magnetic core is positioned between PCB layers with pre-preg material applied, and the entire assembly is laminated in one operation. This combines what could be separate complex operations (embedding, adhesive application, encapsulation) into a single integrated manufacturing step that uses existing PCB fabrication capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the integration of magnetic components within semiconductor packages, reducing size and complexity, achieving higher circuit density, improved power performance, and lower manufacturing costs while providing high voltage isolation and thermal conductivity.
Implementation Method 1
a thermally conductive pre-preg along the walls of each of the two or more posts
Implementation Method 2
at least one set of windings encircling at least one of the two or more posts
Data Source
AI summary
A printed circuit board (PCB) substrate which can be used in a semiconductor package, such as BGA and LGA, has a top surface and a bottom surface. A magnetic component includes a laterally extending bottom plate, two or more vertically extending posts, and a laterally extending top plate, wherein the bottom plate is fully embedded within the PCB substrate and the two or more posts extend in the PCB substrate from the bottom plate toward the upper surface of the PCB substrate. The top plate contacts an end of each of the two or more posts along the top surface of the PCB substrate.