Embedded Magnetic Sensor Package for Compact Precision
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Solution Overview
Problem
Conventional magnetic sensor arrangements face limitations in achieving high sensing accuracy due to assembly tolerances and the distance between magnetic sensing elements and magnetic field generating structures, which affects the precision and compactness of the sensors.
Innovation Solution
A magnetic sensor arrangement is designed with a component board having an accommodation hole for a magnetic field generating structure, where a magnetic sensor package with a sensing element on a carrier is partially or fully embedded within the board, reducing the vertical thickness and increasing accuracy by placing the sensing element close to the axial center, thus minimizing the distance to the magnetic elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the magnetic sensor package is mounted on the component board with the sensing element extending towards the board, then the sensing accuracy is improved by reducing the distance to the magnetic field generating structure, but the vertical thickness of the assembly increases
Solution Approach 1:
The magnetic sensor package is partially embedded into the component board, with the sensing element extending through the board thickness to position itself close to the magnetic field generating structure. This nesting approach allows the sensor to achieve high sensing accuracy while maintaining a compact overall vertical profile, as the sensor package utilizes the internal space of the component board rather than adding entirely external thickness.
Solution Approach 2:
The sensing element is oriented to extend in the vertical direction through the component board, perpendicular to the board surface. This dimensional orientation allows the sensing element to reach close to the magnetic field generating structure (improving accuracy) while the carrier and package structure maintain a compact footprint in the horizontal plane.
2Length of stationary object
If the magnetic sensor package is embedded within the component board, then the vertical thickness is reduced and compactness is improved, but the distance to the magnetic field generating structure increases
Solution Approach 1:
The magnetic sensor package is divided into multiple segments: the carrier structure remains mounted on the external surface of the component board, while the sensing element itself extends through the board thickness to reach close to the magnetic field generating structure. This segmentation allows different parts of the sensor assembly to serve different functions - the carrier provides mechanical support and electrical connections, while the sensing element achieves optimal positioning for accurate magnetic field detection.
3Measurement precision
If the sensing element is positioned close to the axial center to minimize distance to magnetic elements, then sensing accuracy is improved, but the assembly becomes more complex
Solution Approach 1:
The component board and magnetic sensor package are merged into a single integrated assembly. The sensing element extends through the component board, and the carrier is mounted on the board surface, creating a unified structure where the board serves both as a mechanical support and as part of the sensor assembly. This merging reduces the number of separate components and simplifies the overall assembly process while maintaining the sensing element's optimal position near the axial center.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the accuracy and compactness of the magnetic sensor arrangement by reducing the vertical thickness and maintaining a small axial dimension, leading to improved precision in magnetic field detection while preventing collisions with rotating parts.
Implementation Method 1
a magnetic sensor package located at least partially between the two opposing main surfaces and configured for sensing a magnetic field generated by the magnetic field generating structure
Data Source
AI summary
Magnetic sensor arrangement comprising a component board delimited by two opposing main surfaces and having an accommodation hole for accommodating at least part of a magnetic field generating structure, and a magnetic sensor package located at least partially between the two opposing main surfaces and configured for sensing a magnetic field generated by the magnetic field generating structure.