Embedded Magnetic Transformer Structure for Compact Package Substrates
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Solution Overview
Problem
Existing transformers in isolated power supply modules have a large size due to numerous turns of primary and secondary inductor coils, leading to increased production costs and inability to be effectively embedded within package substrates, which hinders miniaturization and high integration demands.
Innovation Solution
A method involving a copper-clad substrate with electroplated coils, laminated prepreg and copper sheets, drilled through holes filled with magnetic material, and layered metal structures to form a closed magnetic circuit, embedding the transformer within the package substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the transformer uses traditional surface mounting with large numbers of turns of primary and secondary inductor coils, then the production process is mature and reliable, but the transformer size becomes large and production cost increases
Solution Approach 1:
The patent transitions from traditional surface-mounted planar transformer structure to a three-dimensional embedded structure within the package substrate. The magnetic transformer is embedded in the middle layer of the package substrate, with primary and secondary coils wound around magnetic cores in the vertical dimension, enabling compact integration while maintaining performance
Solution Approach 2:
The patent embeds the magnetic transformer structure within the package substrate layers, nesting the transformer components (magnetic cores, coils, insulation) within the substrate thickness. The first and second magnetic cores are embedded in the substrate with coils wound around them, creating a compact nested arrangement that reduces overall size
2Ease of manufacture
If the transformer uses traditional surface mounting method, then the manufacturing technology is mature, but additional production process is added and production cost is increased
Solution Approach 1:
The patent combines the transformer manufacturing process with the package substrate fabrication process into a single integrated flow. The magnetic transformer is manufactured and embedded within the same production line that creates the package substrate, eliminating separate transformer assembly steps and reducing overall production complexity
Solution Approach 2:
The magnetic transformer components (magnetic cores, coils, insulation layers) are prepared and embedded within the package substrate during the substrate fabrication process itself, before final assembly. This preliminary integration of transformer manufacturing into substrate production eliminates subsequent assembly steps
3Reliability
If the transformer is made with large size to accommodate numerous turns of coils, then the inductance requirement is met, but the transformer cannot be effectively embedded inside the package substrate
Solution Approach 1:
The patent uses different magnetic core materials with different permeability characteristics in different regions of the transformer structure. The first and second magnetic cores have specific permeability ranges (100-500 and 50-200 respectively) optimized for their local functions, enabling compact design while maintaining required inductance
Solution Approach 2:
The patent employs composite construction with magnetic core materials, insulation materials, and conductive materials in specific combinations. The magnetic transformer includes magnetic cores made of specific magnetic materials, insulation layers made of resin or ceramic materials, and copper coils, creating a composite structure that achieves high inductance in compact form
4Volume of moving object
If the transformer size is reduced for miniaturization, then the embeddability in package substrate is improved, but the number of turns of coils must be reduced which affects inductance
Solution Approach 1:
The patent changes the magnetic core permeability parameter to achieve higher inductance in fewer turns. By using magnetic cores with optimized permeability values (first magnetic core: 100-500, second magnetic core: 50-200), the transformer achieves required inductance with reduced turn counts, enabling size reduction while maintaining performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces transformer size, increases inductance, decreases input voltage frequency, and lowers direct-current resistance, achieving miniaturization and cost-effectiveness while meeting high integration requirements.
Implementation Method 1
electroplating on an upper surface and a lower surface of the copper-clad substrate to form a coil for the magnetic transformer
Implementation Method 2
the plurality of first embedded magnets are coupled to the plurality of second embedded magnets to form a closed magnetic circuit, and the closed magnetic circuit and the coil form the magnetic transformer
Data Source
AI summary
An embedding method and embedded structure for a magnetic transformer, an electronic device and a storage medium are disclosed. The method includes: providing a copper-clad substrate; electroplating on surfaces of the copper-clad substrate to form a coil; laminating prepregs and copper sheets to form a first substrate; drilling the first substrate to define a first and second through hole; filling a magnetic material in the first through holes to form first embedded magnets; forming a metal layer on an inner wall of the second through hole and surfaces of the first substrate; manufacturing conductive pillars and sacrificial blocks; laminating insulating layers; etching the sacrificial block to define cavities; filling a magnetic material in the cavities to form second embedded magnets; and manufacturing a circuit and a solder resist layer on surfaces of the insulating layer to form a package substrate.