Embedded Magnetic Component Venting for Isolation and Low Leakage
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Solution Overview
Problem
Embedded magnetic component devices face issues with air bubbles during epoxy gel solidification, mechanical stress due to thermal expansion differences, and reduced dielectric strength due to air gaps, leading to potential device failure and increased size requirements for isolation and winding turns.
Innovation Solution
The solution involves an insulating substrate with vents on the same side of the magnetic core, side nodes for electrical connections, and multilayer windings wrapped around one side of the core, which reduces delamination risks, thermal stress, and maintains high isolation characteristics while minimizing device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy gel is used to fill the cavity and solidify, then the magnetic component is fully covered and mechanically supported, but air bubbles form during solidification and expand during reflow soldering causing device failure
Solution Approach 1:
The patent removes the harmful epoxy gel filling from the cavity, extracting the source of air bubble formation. Instead of filling the cavity with epoxy gel, the invention uses air gaps between the magnetic core and cavity walls, eliminating the solidification process that traps air bubbles while still providing mechanical support through the substrate structure itself.
Solution Approach 2:
The patent converts the harmful effect of air gaps (which reduce dielectric strength) into a beneficial feature by strategically positioning vent channels that allow controlled air flow paths. The air gaps that would normally cause isolation problems are managed through vent channels that prevent pressure buildup during reflow soldering, transforming a potential harm into a protective mechanism.
2Reliability
If air gap is maintained between magnetic core and cavity sides to avoid epoxy gel issues, then device failure from air bubbles is prevented, but spacing between primary and secondary windings must be large reducing isolation value
Solution Approach 1:
The patent introduces vent channels as intermediary structures that mediate between the air gap requirement and isolation requirement. These channels provide controlled pathways for air flow while the surrounding substrate material maintains dielectric strength and isolation between windings. The vent channels act as intermediaries that allow air gaps to exist without compromising the isolation value, as the channels are strategically positioned and sized to maintain electrical isolation.
3Object-affected harmful factors
If vents are created in the substrate, then air flow path is established preventing air bubble damage, but substrate area available for through holes and vias is reduced
Solution Approach 1:
The patent applies local quality by positioning vent channels in specific locations where they provide maximum air flow benefit with minimum impact on winding area. The vent channels are strategically placed in regions that do not interfere with the optimal placement of through holes and vias for the primary and secondary windings. This localized approach ensures that the venting function is achieved while preserving substrate area for electrical connections.
4Ease of manufacture
If mechanical stress from thermal expansion differences is not addressed, then manufacturing is simpler, but magnetic core cracks due to stress during operation
Solution Approach 1:
The patent uses the substrate as a flexible buffer structure that can accommodate thermal expansion differences between the magnetic core and surrounding materials. The substrate's mechanical properties allow it to flex and absorb stress during thermal cycling, preventing crack formation in the magnetic core while maintaining structural integrity. This approach maintains manufacturing simplicity by not requiring complex stress compensation mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances coupling and inductance performance, reduces leakage inductance, and maintains high isolation characteristics, addressing the challenges of air bubbles, thermal stress, and size constraints in embedded magnetic component devices.
Implementation Method 1
the insulating substrate includes a first vent channel and a second vent channel that create an air path between the cavity and an exterior of the substrate
Implementation Method 2
a coil conductor is created around the magnetic component. The coil conductor is for an embedded transformer and has primary and secondary windings
Implementation Method 3
mechanical stresses introduced by differences between the coefficient of thermal expansions of the magnetic core, the epoxy gel, and the substrate can cause the magnetic core to crack
Data Source
AI summary
A device includes an insulating substrate including a cavity and a magnetic core in the cavity. The insulating substrate includes a first opening and a second opening that connect the cavity to an exterior of the insulated substrate. The first opening and the second opening are provided on a same side of the magnetic core.