Embedded Mask Glass Optics With Void-Free Non-Adhesive Bonding
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Solution Overview
Problem
Traditional adhesive bonding processes for glass optical components result in gaps, voids, and inconsistent thickness, leading to unreliable optical performance due to delamination and heterogeneous light transmission.
Innovation Solution
Employ non-adhesive bonding processes such as fusion, anodic, or reactive bonding, combined with silicon oxide coatings and embedded masks to ensure uniform thickness and improved optical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive bonding process is used to join glass member components, then the components can be connected together, but gaps and voids appear at the joint and bonding reliability deteriorates with aging
Solution Approach 1:
The patent changes the bonding parameters by transitioning from adhesive bonding to direct glass-to-glass bonding processes (fusion bonding, anodic bonding, or reactive bonding). This parameter change eliminates the adhesive layer and its associated gaps and voids, achieving gap-free joints with superior long-term reliability and resistance to delamination.
Solution Approach 2:
The patent extracts and removes the adhesive material from the bonding interface. By eliminating the adhesive layer entirely and directly bonding the glass member components together, the patent eliminates the source of gaps, voids, and potential delamination, thereby improving bonding reliability.
2Ease of manufacture
If adhesive bonding process is used to join glass member components, then the components can be connected together, but the bonding layer thickness varies significantly causing heterogeneous optical performance
Solution Approach 1:
The patent changes the bonding parameters by eliminating the adhesive layer and implementing direct glass-to-glass bonding. This results in a uniform bonding interface with consistent thickness, eliminating the heterogeneous optical performance caused by variable adhesive layer thickness.
Solution Approach 2:
The patent achieves homogeneity in the bonding interface by directly bonding glass member components together without an intermediate adhesive layer. The resulting uniform bonding interface ensures consistent optical properties across the entire joint area, eliminating light transmission heterogeneity.
3Ease of manufacture
If adhesive bonding process is used to join glass member components, then the components can be connected together, but optical performance deteriorates due to heterogeneous light transmission
Solution Approach 1:
The patent changes the bonding parameters by removing the adhesive material and implementing direct glass-to-glass bonding. This creates a uniform optical interface that ensures homogeneous light transmission, eliminating the optical performance deterioration caused by variable adhesive thickness and material properties.
Solution Approach 2:
The patent extracts and removes the adhesive material from the bonding interface, which is the source of optical heterogeneity. By eliminating the adhesive layer, the patent achieves uniform light transmission across the bonded joint, thereby maintaining high optical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Eliminates gaps and voids, enhances bonding quality, and reduces flare by using non-adhesive bonding and embedded masks, resulting in consistent and high-quality optical performance.
Implementation Method 1
with silicon oxide coatings
Implementation Method 2
non-adhesive bonding processes such as fusion, anodic, or reactive bonding
Implementation Method 3
non-adhesive bonding processes such as fusion, anodic, or reactive bonding
Data Source
AI summary
A glass optical component with embedded mask may be formed from multiple, discrete glass member components using a non-adhesive bonding process. A black mask may be created at a surface of a first member component using a deposition or a printing-and-sintering process. A backfill coating may then be applied to and then polished at the surface of the first member component. Next, the first member component may be bonded with a second member component, with the non-adhesive bonding process, at the surface of the first member component to form the optical component with the black mask embedded between the first and second member components. In addition, the glass optical component forming process may be implemented on a glass wafer level to make multiple glass optical components at a same time.