Embedded Memory Die Stacking in PCB Cavities for Higher Capacity
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Solution Overview
Problem
There is a need to increase the storage capacity of flash memory storage devices without expanding their overall size, as existing packaging configurations limit the number of semiconductor dies that can be stacked within a given footprint.
Innovation Solution
The solution involves forming a substrate with a cavity in the bottom surface, allowing for the stacking of memory dies within the cavity and on the top surface, with electrical interconnections via bond wires, and using a sealing compound to encase the assembly, enabling a higher density of memory dies without increasing the device's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If semiconductor dies are stacked on the substrate surface with offset and/or overlapping, then storage capacity increases, but the overall device size increases
Solution Approach 1:
The patent embeds semiconductor dies within a cavity formed in the substrate, nesting the dies inside the substrate volume rather than placing them on the external surface. This allows the dies to be contained within the existing device footprint, increasing storage capacity without increasing the overall device volume. The cavity acts as a nested space that utilizes the substrate's internal volume for die placement.
Solution Approach 2:
The invention transitions from two-dimensional surface stacking to three-dimensional internal cavity embedding. By forming a cavity within the substrate and placing dies inside it, the solution utilizes the vertical dimension and internal volume of the substrate, effectively moving from surface-level arrangement to volumetric utilization, thereby increasing capacity without expanding the device's external dimensions.
2Quantity of substance
If more semiconductor dies are integrated into the package, then storage capacity increases, but manufacturing complexity increases
Solution Approach 1:
The substrate is segmented into distinct functional regions: a top surface for mounting dies and a cavity within the substrate for embedding additional dies. This segmentation allows different numbers and types of dies to be placed in different regions, enabling flexible capacity scaling without requiring a complete redesign of the packaging structure. The cavity itself is segmented from the substrate volume, creating a dedicated space for additional dies.
Data Source
AI summary
A semiconductor device includes a signal carrier medium such as a PCB substrate having first and second opposed surfaces and a cavity formed in the second surface. A first set of one or more semiconductor dies are mounted on the first surface, and a second set of one or more semiconductor dies are mounted within the cavity. The first and/or second sets of semiconductor dies may be memory dies.