Embedded Metal Heat Dissipation Plate in Semiconductor Modules
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor modules with sealed semiconductor elements have inefficient heat dissipation paths that include multiple materials with low thermal conductivity, limiting the improvement of heat dissipation performance from the semiconductor element to the cooling body.
Innovation Solution
A semiconductor module with resin-molded semiconductor devices mounted on a metal base, where a metal heat dissipation plate exposed on the insulating substrate is embedded in the metal base, reducing the heat dissipation path to only an insulating substrate and metal heat dissipation plate, enhancing direct contact with the cooling body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple materials (solder, conductive patterns, insulating substrates) are used in the heat dissipation path, then electrical connection and insulation are ensured, but thermal conductivity deteriorates
Solution Approach 1:
The patent extracts and removes intermediate materials (solder, conductive patterns) from the heat dissipation path between the semiconductor element and cooling body. By directly bonding the metal heat dissipation plate to the semiconductor element mounting surface, the heat dissipation path is simplified to minimize thermal resistance while maintaining electrical connection reliability through the metal base structure.
Solution Approach 2:
The patent employs a composite structure where a metal heat dissipation plate is integrated with an insulating substrate. The metal plate provides high thermal conductivity for heat dissipation, while the insulating substrate ensures electrical isolation. This composite design allows simultaneous optimization of both heat dissipation efficiency and electrical insulation performance.
2Reliability
If conventional heat dissipation path with multiple layers is used, then electrical insulation is maintained, but thermal resistance increases
Solution Approach 1:
The metal base serves as an intermediary structure that simultaneously provides thermal conduction and electrical insulation functions. The metal heat dissipation plate embedded in the metal base creates a direct thermal pathway to the cooling body, while the insulating substrate integrated with the metal base maintains electrical insulation, thereby resolving the contradiction between thermal and electrical performance.
3Volume of moving object
If power density is increased to reduce device size, then miniaturization is achieved, but heat dissipation demand increases
Solution Approach 1:
The patent changes the thermal conductivity parameter of the heat dissipation path by using a metal heat dissipation plate with high thermal conductivity directly bonded to the semiconductor element. This parameter change enables efficient heat dissipation in a compact structure, allowing power density increase without compromising thermal management performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation efficiency by eliminating low thermal conductivity materials in the heat path, resulting in a semiconductor module with reduced thermal resistance and increased reliability, less susceptible to thermal fatigue.
Implementation Method 1
the heat dissipation path from the semiconductor element to the cooling body includes the semiconductor element, solder, a conductive pattern, an insulating substrate, a conductive pattern, solder, and a copper block
Data Source
AI summary
An object of the present invention is to provide a semiconductor module that can improve the dissipation of heat from semiconductor elements toward a cooling body. A semiconductor module of the present invention includes a plurality of resin-molded semiconductor devices that are mounted on a single metal base and are electrically connected. The plurality of semiconductor devices each have a structure in which a metal heat dissipation plate, which is formed on a surface of an insulating substrate on the side opposite to a semiconductor-element-mount surface, is exposed from a resin mold, and the metal heat dissipation plate is embedded in each opening provided in the metal base, so that the rear surface of the metal heat dissipation plate becomes a plane to be disposed on a cooling body.