Embedded Metal Heat Spreader in PBGA Molding Compound
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in semiconductor packaging is controlling thermal characteristics due to limited space for efficient thermal conductivity solutions, particularly in Plastic Grid Ball Array (PBGA) packages, where conventional heat spreading structures are difficult to implement.
Innovation Solution
Embedding a metal component within insulating material in semiconductor device packaging to act as a heat spreader, isolated from the substrate, which enhances heat dissipation without physical contact, using a process involving a compression mold and molding compound to encapsulate the metal layer with semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal heat spreading structure is secured to the lead frame, then heat dissipation is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The metal heat spreading structure is merged with the molding compound to form an integrated package structure. The metal component is embedded within the molding material during the molding process, combining the thermal management function with the protective packaging function into a single unified structure, thereby reducing overall device complexity.
Solution Approach 2:
The metal heat spreading structure is prepared and positioned in advance within the molding compound cavity before the final packaging step. This preliminary placement allows the metal component to be seamlessly integrated into the package structure during molding, avoiding complex post-assembly operations.
2Temperature
If conventional heat spreading structures are implemented, then thermal characteristics are improved, but ease of manufacture deteriorates due to space constraints
Solution Approach 1:
The heat spreading structure transitions from a conventional planar configuration to a three-dimensional embedded form within the molding compound. This dimensional change allows the metal component to utilize the vertical space within the package, enabling effective thermal management without increasing the package footprint or complicating the manufacturing process.
3Temperature
If metal component is embedded in insulating material, then heat dissipation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The molding process itself provides the positioning and securing mechanism for the metal heat spreading structure. The molding compound automatically encapsulates and holds the metal component in its intended position during curing, eliminating the need for separate precision positioning steps or additional securing mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively increases heat dissipation from semiconductor devices by utilizing materials with higher thermal conductivity than the insulating material, improving device performance and reliability while minimizing warping and securing the package.
Implementation Method 1
utilizing materials with higher thermal conductivity than the insulating material
Implementation Method 2
The semiconductor devices are compressed into the molding compound to (i) embed the metal film into the molding compound, and to (ii) prevent physical contact between the metal film and the lead frame
Data Source
AI summary
Embodiments of the present disclosure describe semiconductor device packaging techniques and devices that incorporate a heat spreader into the insulating material of a packaged semiconductor device. In one embodiment, a device comprising a semiconductor device is coupled to a substrate, and insulating material covers (i) a portion of the semiconductor device and (ii) a portion of the substrate. The device also comprises a heat spreader embedded in the insulating material and the heat spreader is isolated from the substrate at least in part by the insulating material.