Embedded Metal Stiffener for PCB Rigidity

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Thin printed circuit boards (PCBs) are less rigid and more prone to warpage and damage due to their reduced thickness, which can lead to manufacturing and assembly issues such as poor solder joints and component displacement, and existing solutions like metal brackets increase the PCB footprint or obstruct access to connectors.

Innovation Solution

A metal stiffener is embedded within the keep out zone (KOZ) of the PCB, extending along the perimeter without increasing the board's thickness or footprint, providing additional strength and rigidity while allowing for non-linear edge attachment and electrical shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Weight of moving object

If PCB thickness is reduced to decrease device size and weight, then miniaturization is achieved, but rigidity and resistance to warpage deteriorate

Engineering Contradiction:

ImprovePCB weightVSAvoidPCB rigidity

Core Design Contradiction:

Weight of moving objectVSStrength

Solution Approach 1:

The metal stiffener is nested within the keep out zone (KOZ) area of the PCB, utilizing the existing space without adding external structures. The stiffener is positioned between the PCB layers, embedded in the dielectric material, creating a nested configuration that reinforces the board without increasing its footprint or thickness.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The solution creates a composite structure by combining the PCB substrate with a metal stiffener element. The stiffener is made of metal material (such as copper, aluminum, or steel) and is integrated with the PCB layers through dielectric material, forming a composite structure that provides enhanced mechanical strength while maintaining electrical functionality.

Inventive Principle:

Principle #40Composite materials

2Strength

If metal brackets are added to increase PCB rigidity, then strength is improved, but device footprint and complexity increase

Engineering Contradiction:

ImprovePCB rigidityVSAvoidPCB footprint

Core Design Contradiction:

StrengthVSArea of stationary object

Solution Approach 1:

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

Instead of adding metal brackets in the planar view (2D footprint), the solution transitions to the vertical dimension by embedding the stiffener between PCB layers. This vertical integration allows the stiffener to be contained within the PCB thickness envelope, specifically within the KOZ region, thereby providing strength without increasing the board's area.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20230108868A1Methods and apparatus to increase rigidity of printed circuit boards

Publication Date: 2023.04.06 INTEL CORP

AI summary

Methods, apparatus, systems, and articles of manufacture to increase rigidity of printed circuit boards are disclosed. An apparatus includes a stack of insulative layers. The stack includes a first face and a second face opposite the first face. The apparatus further includes a plurality of conductive layers. Ones of the conductive layers between adjacent ones of the insulative layers. The apparatus also includes a metal stiffener extending along a perimeter of a first one of the insulative layers. The metal stiffener has a thickness measured in a direction perpendicular to the first face. The thickness is less than a distance between the first and second faces.