Embedded Metallic Structures in Glass Wafer Hermetic Sealing
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Solution Overview
Problem
Implantable medical devices face challenges in achieving a small size, hermetic sealing, and bio-stability when exposed to bodily fluids, as current materials and designs fail to provide an effective barrier against fluid exposure and conductive trace protection.
Innovation Solution
The integration of embedded metallic structures within a glass wafer structure, including a conductive trace on a first wafer filled with conductive material, a planarized insulation layer, and a bonded second wafer, which forms a hermetically sealed and bio-stable package, allowing for thicker walls and reduced device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the housing wall thickness is increased to provide better hermetic sealing and protection, then the reliability and bio-stability improve, but the overall device size increases
Solution Approach 1:
The patent embeds metallic structures (conductive traces and via fills) directly within the glass housing walls themselves, nesting the electrical interconnect features inside the protective barrier. This eliminates the need for separate internal cavities or thicker walls to accommodate traces, allowing thin-walled hermetic packaging while maintaining electrical connectivity.
Solution Approach 2:
The patent transitions from planar conductive traces on surfaces to three-dimensional embedded structures within the glass matrix. By moving conductive elements into the third dimension (within the wall thickness), the design achieves both protection and connectivity without increasing external device dimensions.
2Reliability
If conventional hermetic sealing methods are used, then the protection against bodily fluids is provided, but the device size and complexity increase
Solution Approach 1:
The patent merges the housing structure with the electrical interconnect structure by embedding conductive traces and via fills directly within the glass housing material. This combination eliminates separate components for sealing and electrical connection, reducing overall device complexity while maintaining hermetic protection.
Solution Approach 2:
The patent uses glass as a composite material that simultaneously provides hermetic sealing, structural integrity, and embedded electrical connectivity. The glass housing integrates multiple functions (protection, structural support, and electrical interconnection) into a single material system, simplifying the overall device architecture.
3Reliability
If metallic structures are embedded in glass, then the hermetic seal and bio-stability are improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent forms conductive via fills and traces within the glass housing during the housing fabrication process itself, before final assembly. By performing electrical interconnect formation as a preliminary step during glass processing, the manufacturing sequence is optimized to reduce overall process complexity despite the advanced embedding technique.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the life expectancy of implantable medical devices by providing a robust, hermetically sealed, and bio-stable environment that protects conductive traces from bodily fluids, extending the device's operational life while minimizing size.
Implementation Method 1
the housing (packaging) of the medical devices needs to provide a hermetic seal to separate the internal circuits of the device from the bodily fluids of the patient
Implementation Method 2
The first wafer has at least one first wafer via filled with conductive material. The at least one conductive trace is formed on a surface of the first wafer. The at least one conductive trace is in contact with the at least one first wafer via that is filled with the conductive material
Implementation Method 3
The planarized insulation layer is formed over the first wafer and at least one conductive trace. The planarized insulation layer further has at least one insulation layer via that provides a path to a portion of the at least one conductive trace
Implementation Method 4
The second wafer is bonded to the planarized insulation layer
Data Source
Figure 1
Figure 2A~2C
Figure 3
AI summary
A device having embedded metallic structures in a glass is provided. The device includes a first wafer, at least one conductive trace, a planarized insulation layer and a second wafer. The first wafer has at least one first wafer via that is filled with conductive material. The at least one conductive trace is formed on the first wafer. The at least one conductive trace is in contact with the at least one first wafer via that is filled with the conductive material. The planarized insulation layer is formed over the first wafer and at least one conductive trace. The planarized insulation layer further has at least one insulation layer via that provides a path to a portion of the at least one conductive trace. The second wafer is bonded to the planarized insulation layer.