Embedded and packaged heat dissipation structure and manufacturing method therefor, and semiconductor
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Solution Overview
Problem
Traditional embedding and packaging methods for semiconductor components fail to effectively address the high heat dissipation requirements of high-frequency, high-speed, and high-power products, even with the use of organic polymer materials.
Innovation Solution
A manufacturing method for an embedded and packaged heat dissipation structure involving a semi-finished plate with a first metal layer, a heat dissipation plate, a copper column, and a microchannel, where the heat dissipation plate and copper column are arranged in the microchannel, and a sealing layer is applied to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional plastic packaging material is used for embedding and packaging, then the packaging structure is simple and easy to manufacture, but the heat dissipation performance is insufficient for high-frequency, high-speed, and high-power products
Solution Approach 1:
The patent uses composite materials consisting of metal layers (copper or aluminum) combined with dielectric materials to create a metal core substrate. This composite structure provides both the mechanical properties needed for packaging and superior thermal conductivity for heat dissipation, resolving the contradiction between simple packaging structure and adequate heat dissipation performance.
Solution Approach 2:
The patent extracts the heat dissipation function from the traditional plastic packaging material and implements it through a separate metal core substrate with dedicated heat dissipation structures (heat dissipation plates and copper columns). This separation allows the packaging structure to maintain simplicity while the metal substrate handles thermal management independently.
2Temperature
If organic polymer material with good heat dissipation is used, then the heat dissipation capability is improved, but it still cannot solve the heat dissipation problem of high-frequency, high-speed, and high-power embedded products
Solution Approach 1:
The patent fundamentally changes the thermal conductivity parameter by transitioning from organic polymer materials to metal materials (copper or aluminum) with inherently superior thermal conductivity. This parameter change enables effective heat dissipation for high-power applications that organic materials cannot achieve, while the metal core substrate maintains structural reliability.
3Temperature
If metal layers and microchannels are added to improve heat dissipation, then the heat dissipation effectiveness is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent incorporates heat dissipation plates and copper columns into the substrate during the initial manufacturing process before final packaging assembly. The microchannels are also formed in advance within the dielectric layer. These preliminary actions integrate heat dissipation structures into the manufacturing flow, reducing the need for complex post-assembly operations and maintaining ease of manufacture while achieving enhanced heat dissipation effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly improves heat dissipation for embedded devices, meeting the requirements of high-frequency and high-speed products by effectively conducting heat away from the semiconductor components.
Implementation Method 1
a heat dissipation copper column is manufactured on the heat dissipation plate; providing a dielectric layer, wherein the dielectric layer covers the heat dissipation copper column
Implementation Method 2
partially etching the second metal layer and the dielectric layer to form a microchannel, wherein the heat dissipation copper column and the heat dissipation plate are arranged in the microchannel
Data Source
AI summary
A method for manufacturing an embedded and packaged heat dissipation structure includes: forming a semi-finished plate, the semi-finished plate including an embedded device and a first metal layer attached to a non-pin surface of the embedded device; forming a heat dissipation plate attached to the non-pin surface of the embedded device; manufacturing a heat dissipation copper column; providing a dielectric layer covering the heat dissipation copper column; laminating a second metal layer; partially etching the second metal layer and the dielectric layer to form a microchannel in which the heat dissipation copper column and the heat dissipation plate are arranged; removing a remaining part of the second metal layer; and laminating a sealing layer on the dielectric layer to seal the microchannel in a direction perpendicular to a semi-finished plate to obtain the embedded and packaged heat dissipation structure.