Embedded Microfan IC Package for High-TDP Thermal Control
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Solution Overview
Problem
Conventional cooling systems for high-power integrated circuit (IC) packages struggle to efficiently manage heat dissipation as ICs with increasing thermal design power (TDP) exceed the capabilities of passive heat sinks and traditional fan-based cooling systems.
Innovation Solution
An integrated circuit package with embedded microfans and temperature sensors, where fan control logic adjusts the speed of each microfan based on temperature signals from sensors located near or adjacent to the fans, optimizing airflow and heat extraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If passive heat sinks are used for cooling high-power IC packages, then the structure is simple and reliable, but the heat dissipation capability becomes insufficient as TDP increases
Solution Approach 1:
The cooling system is segmented into multiple independent microfans distributed across the IC package surface, each responsible for a specific region. This segmentation allows the system to handle high TDP by distributing cooling effort across multiple units rather than relying on a single complex heat sink structure.
Solution Approach 2:
The microfans are controlled dynamically based on real-time temperature sensor feedback. Each microfan's speed is adjusted independently according to the thermal conditions in its region, enabling adaptive cooling that responds to changing thermal loads and improves overall cooling effectiveness.
2Reliability
If traditional fan-based cooling systems are used, then heat dissipation capability is sufficient for high TDP, but the volume required for cooling increases
Solution Approach 1:
The cooling system transitions from traditional large-volume external fans to miniaturized microfans that can be integrated directly onto the IC package surface. This dimensional reduction allows the cooling components to be embedded within the package footprint rather than requiring additional external space.
Solution Approach 2:
Multiple microfans and temperature sensors are embedded within the IC package structure itself, nesting the cooling system components inside the package volume. This integration allows the cooling system to occupy the same spatial envelope as the IC rather than requiring separate external space.
3Productivity
If multiple temperature sensors and microfans are embedded in the IC package, then heat extraction efficiency is optimized, but the manufacturing complexity increases
Solution Approach 1:
The encapsulation material serves multiple functions: it protects the IC die, provides structural support, and acts as the housing for embedding the microfans and temperature sensors. This multi-functionality reduces the need for additional separate components and simplifies the overall manufacturing process.
Solution Approach 2:
The microfans, temperature sensors, and encapsulation material are combined into an integrated assembly. The sensors are positioned to detect temperatures at critical locations, and the microfans are strategically placed to maximize heat extraction efficiency, creating a coordinated thermal management system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat extraction efficiency, supports high-TDP ICs, and reduces the volume required for cooling, potentially leading to a lower-profile electronic device.
Implementation Method 1
each of the plurality of microfans is configured to create airflow upward from the top surface of the encapsulation material
Implementation Method 2
each sensor of the plurality of sensors produces a signal indicating a temperature at a location of the sensor
Implementation Method 3
the encapsulation material further defines at least one air vent communicatively coupled to at least one of the plurality of cavities such that air is drawn through the air vent into the at least one of the plurality of cavities
Data Source
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AI summary
The disclosed IC package may include (1) an IC die carrying electronic circuitry, (2) an encapsulation material that at least partially covers the IC die, where the encapsulation material defines a plurality of cavities in a top surface of the encapsulation material, (3) a plurality of microfans located in the plurality of cavities, and (4) a plurality of sensors embedded in the encapsulation material, where each sensor of the plurality of sensors produces a signal indicating a temperature at a location of the sensor. Various other IC packages, as well as associated cooling systems and methods, are also disclosed.