Embedded Microstrip Layout for Low-Crosstalk Quantum Circuits
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Solution Overview
Problem
Conventional coplanar waveguide transmission lines in superconducting microwave electronics experience high crosstalk, limiting miniaturization and placement density due to the need for physical spacing and extensive shielding, which restricts the circuitry architecture of quantum processors.
Innovation Solution
Embedding microstrip transmission lines underneath a superconducting ground plane on a raised portion of a dielectric substrate, covered by a low-loss dielectric film, reduces crosstalk and enables higher transmission line density by shielding effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If coplanar waveguide transmission lines are used in superconducting microwave electronics, then the transmission lines can be fabricated with conventional processes, but high crosstalk occurs between adjacent transmission lines
Solution Approach 1:
The patent transitions from coplanar waveguide transmission lines where all conductors lie in the same plane to microstrip transmission lines where the signal conductor is positioned on a raised portion above the ground plane, utilizing the vertical dimension to reduce electromagnetic coupling and crosstalk between adjacent lines
Solution Approach 2:
The patent embeds the microstrip transmission line structure within a layered architecture where the signal conductor on the raised portion is surrounded by dielectric material and positioned beneath a superconducting ground plane, creating a nested configuration that provides shielding and reduces crosstalk
2Object-affected harmful factors
If physical spacing and extensive shielding are used to reduce crosstalk, then crosstalk between transmission lines is reduced, but transmission line density and miniaturization are limited
Solution Approach 1:
By utilizing the vertical dimension with the raised portion structure, the patent achieves effective shielding and crosstalk reduction without requiring increased horizontal spacing between transmission lines, thereby maintaining high transmission line density
Solution Approach 2:
The patent changes the geometric parameters of the transmission line structure by introducing a raised portion with specific height and width dimensions, which modifies the electromagnetic field distribution and reduces crosstalk while allowing compact spacing between adjacent lines
3Object-affected harmful factors
If extensive shielding elements are added to reduce crosstalk, then crosstalk is minimized, but device complexity and circuitry architecture are restricted
Solution Approach 1:
The patent merges the shielding function with the ground plane structure itself, where the superconducting ground plane serves dual purposes as both the reference potential and the shielding element, eliminating the need for separate shielding structures and reducing device complexity
Solution Approach 2:
The ground plane is designed to perform multiple functions simultaneously: providing the reference potential for signal transmission, acting as a shield against electromagnetic interference, and serving as a structural element of the transmission line, thereby reducing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a higher density of transmission lines and improved circuitry architecture in quantum computing devices by minimizing crosstalk and optimizing the placement of qubits and shielding elements.
Implementation Method 1
a dielectric film that covers at least a portion of the superconducting material layer and the raised portion of the dielectric substrate
Implementation Method 2
a superconducting material layer positioned on a raised portion of a dielectric substrate
Data Source
AI summary
Techniques regarding an embedded microstrip transmission line implemented in one more superconducting microwave electronic devices are provided. For example, one or more embodiments described herein can comprise an apparatus, which can include a superconducting material layer positioned on a raised portion of a dielectric substrate. The raised portion can extend from a surface of the dielectric substrate. The apparatus can also comprise a dielectric film that covers at least a portion of the superconducting material layer and the raised portion of the dielectric substrate.