Embedded Electronic Module With Adhesion Promoter for High-Voltage Reliability
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Solution Overview
Problem
Current chip embedding processes fail to meet high voltage application requirements due to limited breakdown voltage, ion impurity levels, and reliability issues with existing PCB materials, as well as adhesion problems with polymer layers leading to potential delamination.
Innovation Solution
An electronic device module is fabricated using a core layer with an opening, an electronic device placed within, and both covered by an adhesion promoter layer, which is then embedded with an encapsulant layer to enhance adhesion and reliability, specifically using Al2O3 and AlOOH layers for improved bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If current PCB materials and chip embedding processes are used, then manufacturing simplicity is maintained, but breakdown voltage is limited to 650V or below and reliability is insufficient for high voltage applications
Solution Approach 1:
The patent applies composite materials by combining multiple material layers with different properties: a core layer (PCB substrate), an adhesion promoter layer (enhancing bonding), and an encapsulant layer (providing protection and insulation). This composite structure enables the module to achieve breakdown voltages exceeding 650V while maintaining structural integrity and reliability, directly resolving the contradiction between reliability improvement and material structure complexity.
2Reliability
If polymer layers like prepreg layers are used for chip embedding, then ease of manufacture is improved, but adhesion is limited and local delamination occurs
Solution Approach 1:
The patent introduces an adhesion promoter layer as an intermediary between the core layer and the encapsulant layer. This intermediate layer specifically addresses adhesion deficiencies by providing enhanced bonding surfaces, preventing local delamination of polymer layers from the core layer and from semiconductor devices, while maintaining manufacturing feasibility through standard lamination processes.
3Reliability
If ion impurity levels in PCB materials are not controlled, then manufacturing cost is reduced, but breakdown voltage and overall reliability are limited for high voltage devices
Solution Approach 1:
The patent applies parameter changes by specifying controlled ion impurity levels in the core layer and encapsulant layer materials. By establishing material parameter specifications (low ion impurity content), the patent enables high voltage applications while maintaining manufacturability through standard material fabrication processes that can achieve these purity levels.
4Reliability
If compact chip embedding is implemented, then power density is improved, but thermal management and power cycling capability are challenged at high voltages
Solution Approach 1:
The patent uses composite materials with differentiated thermal properties in the multi-layer structure. The core layer, adhesion promoter layer, and encapsulant layer are selected and configured to provide both electrical insulation for high voltage and thermal pathways for heat dissipation. This composite approach enables compact chip embedding to maintain power density while improving thermal management and power cycling capability through the coordinated thermal properties of the layered structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability and adhesion of the electronic device module, enabling it to handle higher voltages and improve power cycling capabilities, addressing the limitations of current chip embedding processes.
Implementation Method 1
one or both of the core layer and the electronic device being at least partially covered by an adhesion promoter layer
Data Source
AI summary
An electronic device module includes: a core layer having an opening; an electronic device disposed in the opening, one or both of the core layer and the electronic device being at least partially covered by an adhesion promoter layer; and an encapsulant layer at least partially embedding the core layer and the electronic device.