Embedded Electronic Module Fabrication via Conductive Pattern Growth
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for manufacturing electronic modules with components embedded in insulating layers face challenges in achieving high contact density and efficient electrical connections, often resulting in costly and complex processes with potential misalignment issues.
Innovation Solution
A method involving a resist layer with openings, insulating material, and conductive patterns, where components are embedded and connected using a conductive pattern with connection elements, allowing for precise alignment and cost-effective fabrication with chemical or electrochemical growing methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods are used to manufacture electronic modules with embedded components, then components can be mounted on substrates, but alignment issues and complex processes result
Solution Approach 1:
The patent applies preliminary action by pre-forming conductive patterns on the substrate before component mounting. The conductive patterns are created in advance with precise positioning, and components are subsequently aligned to these pre-established patterns. This eliminates the need for complex post-alignment processes and ensures high alignment precision without increasing overall process complexity.
Solution Approach 2:
The patent replaces mechanical alignment systems with a chemical/electrical approach. Instead of relying on mechanical fixtures or complex mechanical positioning systems, the invention uses pre-formed conductive patterns that guide component placement. The alignment is achieved through the electrical connection requirements rather than mechanical constraints, simplifying the overall system.
2Quantity of substance
If high contact density is achieved through conventional methods, then electrical connections can be established, but production costs increase
Solution Approach 1:
The patent applies segmentation by dividing the conductive connection structure into discrete conductive patterns that are formed separately and then connected. This segmentation allows for optimized material usage in each pattern region, reducing overall material costs while maintaining high contact density. The segmented approach also simplifies the manufacturing process by allowing standardization of pattern formation.
Solution Approach 2:
The patent utilizes parameter changes by varying the conductivity, thickness, and geometry of the conductive patterns to optimize both contact density and manufacturing cost. By adjusting these parameters, the invention achieves high contact density in critical areas while using cost-effective materials and processes in less critical regions, thereby reducing overall production costs.
3Manufacturing precision
If complex fabrication processes are used to ensure precise alignment, then alignment accuracy improves, but manufacturing time increases
Solution Approach 1:
The patent resolves this contradiction by performing alignment-critical operations in advance. The conductive patterns are pre-formed with high precision using automated processes, and their positions are predetermined. This preliminary action allows subsequent component mounting to be performed quickly without compromising alignment accuracy, thereby maintaining high manufacturing speed.
Solution Approach 2:
The patent replaces time-consuming mechanical alignment procedures with a pre-established conductive pattern system. Instead of performing real-time mechanical measurement and adjustment during assembly, the invention uses pre-formed conductive patterns that inherently guide component placement, significantly reducing manufacturing time while preserving alignment accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of electronic modules with high contact density and thin layers, ensuring excellent electrical properties and reducing assembly errors, while being cost-effective and improving yield.
Implementation Method 1
growing conductor material in the via holes
Data Source
AI summary
The present invention concerns an electronic module with at least one component embedded in insulating material. The electronic module comprises a first insulating material having a first surface and a second surface and a thickness between the first surface and the second surface, at least one opening through the first insulating material, a second insulating material on the second surface of the first insulating material, at least one component embedded in the second insulating material, at least one conductive pattern in the at least one opening, the at least one conductive pattern having a first surface and a second surface, wherein the second surface faces the second insulating material and the first surface faces away from the second insulating material and a distance between the first surface of the first insulating material and the second surface of the at least one conductive pattern is less or greater than the thickness of the first insulating material, an adhesive between the first insulating material and the at least one component, and connection elements between the at least one conductive pattern and the at least one component. The present invention further concerns a method for fabrication of an electronic module with at least one component embedded in an insulating layer.