Electronic Component-Embedded Module With Gradient Via-Conductor Resin
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Solution Overview
Problem
Conventional electronic component-embedded modules face issues with bonding portions breaking due to stress from thermal expansion differences between multilayer boards and motherboards, especially as components become more compact and advanced, leading to increased fragility of these connections.
Innovation Solution
The module incorporates a multilayer board with a cavity for the electronic component, featuring board-side and component-side resin layers with via-conductors, and an intermediate resin layer with a lower volume ratio of via-conductors to resin, allowing for elastic deformation and stress absorption, thereby reducing the risk of bonding failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the bonding portions are made smaller to achieve more compact size and advanced functionality, then the compactness and functionality are improved, but the reliability of the bonding portions deteriorates as they become more prone to breaking under stress
Solution Approach 1:
The patent introduces a resin layer with a specific structure that acts as a cushioning layer before stress reaches the bonding portions. This resin layer has a lower via-conductor volume ratio compared to the component-side resin layer, creating a gradient structure that absorbs and distributes thermal stress before it can reach the fragile bonding portions, thereby protecting them from breaking while maintaining compact size
Solution Approach 2:
The patent changes the physical parameters of the resin layers by creating a gradient in via-conductor density. The intermediate resin layer has a lower via-conductor volume ratio than the component-side resin layer, which changes the mechanical properties (flexibility, stress distribution) of the structure to better withstand thermal expansion differences while maintaining compact dimensions
2Adaptability or versatility
If the multilayer board and motherboard are made with different materials to achieve functional requirements, then the functionality is improved, but the stability of the bonding interface deteriorates due to thermal expansion differences causing stress
Solution Approach 1:
The patent introduces an intermediate resin layer as a mediator between the board-side resin layer and the component-side resin layer. This intermediate layer has a lower via-conductor volume ratio, making it more flexible and better at absorbing thermal stress. It acts as a buffer that mediates the stress transfer between the multilayer board and motherboard, protecting the bonding interface from stress-induced failures while allowing different materials to be used for functional requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the module's flexibility and resistance to stress, preventing bonding failures even under significant thermal expansion differences, ensuring reliable mounting and operation.
Implementation Method 1
an intermediate resin layer with a plurality of intermediate via-conductors electrically connected to the board-side via-conductors, and a component-side resin layer stacked on the intermediate resin layer and having a plurality of component-side via-conductors provided therein. The component-side via-conductors at least include a plurality of first component-side via-conductors electrically connected to the intermediate via-conductors and a plurality of second component-side via-conductors bonded to the electronic component and electrically connected to the first component-side via-conductors. An intermediate volume ratio obtained by dividing a total volume of the intermediate via-conductors by a volume of the intermediate resin layer is less than a component-side volume ratio obtained by dividing a total volume of the component-side via-conductors by a volume of the component-side resin layer.
Data Source
AI summary
An electronic component-embedded module mountable on a motherboard has a multilayer board wherein a cavity is formed in order to place an electronic component. The multilayer board includes a board-side resin layer with external electrodes for mounting onto the motherboard and board-side via-conductors connected thereto, an intermediate resin layer with intermediate via-conductors connected to the board-side via-conductors, and a component-side resin layer stacked on the intermediate resin layer and having component-side via-conductors. The component-side via-conductors include first component-side via-conductors connected to the intermediate via-conductors and second component-side via-conductors bonded to the electronic component and connected to the first component-side via-conductors. An intermediate volume ratio obtained by dividing a total volume of the intermediate via-conductors by a volume of the intermediate resin layer is less than a component-side volume ratio obtained by dividing a total volume of the component-side via-conductors by a volume of the component-side resin layer.