Embedded Component Module Layout for Larger Parts in Small Footprints
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Solution Overview
Problem
Existing electronic component modules are limited in size reduction when accommodating electronic components larger than the hole on the substrate, as seen in Japanese Unexamined Patent Application Publication No. 11-135566.
Innovation Solution
The electronic component module incorporates a multilayer wiring board with a hole, featuring a front surface wiring layer and a bottom surface wiring layer, and an electronic component with a projection that fits into the hole, connected by electrodes on facing surfaces, allowing the component to project minimally from the surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the electronic component is accommodated in a hole on the substrate surface, then the thickness of the electronic component module is reduced, but the electronic component size is restricted and cannot exceed the hole size
Solution Approach 1:
The invention transitions from a single-layer substrate to a multilayer wiring board structure, utilizing the thickness dimension to accommodate larger electronic components. By distributing wiring across multiple layers and using via holes for interlayer connections, the design allows components to extend beyond what a single-hole substrate could accommodate while maintaining overall module compactness.
Solution Approach 2:
The electronic component is nested within a cavity formed by the multilayer wiring board structure. The component body is positioned within the internal space created by the stacked layers, with electrodes extending outward to connect with external circuits, effectively hiding the bulk of the component within the module's internal volume.
2Adaptability or versatility
If the electronic component is larger than the hole on the substrate, then the component functionality is improved, but the module size cannot be reduced
Solution Approach 1:
The multilayer wiring board utilizes the vertical stacking dimension to accommodate larger electronic components. By distributing the wiring function across multiple thin layers separated by insulating layers, the design enables larger components to be integrated without proportionally increasing the overall module footprint or thickness.
Solution Approach 2:
The wiring structure is segmented into multiple independent wiring layers, each handling specific electrical connections. This segmentation allows the electronic component to be larger while the overall module size is controlled, as the wiring function is distributed across multiple thin layers rather than requiring a single large planar area.
Data Source
AI summary
An electronic component module includes an electronic component and a multilayer wiring board. The multilayer wiring board includes wiring layers and insulating layers. A disposition surface has a hole. The wiring layers include a front surface wiring layer configuring the disposition surface and a bottom surface wiring layer configuring a bottom surface of the hole. The electronic component includes an electric circuit, an outer contour portion defining an outer contour of the electronic component, and an electrode connecting the electric circuit and the wiring layers. The outer contour portion includes an outer contour portion body on the front surface wiring layer, a first facing surface facing the front surface wiring layer, a projection in the hole, and a second facing surface defining an end surface in a first direction of the projection and facing the bottom surface wiring layer.