Embedded Component Module Structure for Small Connection Holes
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Solution Overview
Problem
Existing electronic component embedded modules face challenges in reducing the hole diameter of connection holes, which affects the module's performance and reliability.
Innovation Solution
The proposed electronic component embedded module includes a hole diameter defining layer, an electronic component with a terminal electrode, and an insulation layer. The hole diameter defining layer has a specific inner and outer wall structure, and the insulation layer covers the outer wall with a step configuration around the front surface. A connection hole extends from the inner wall of the hole diameter defining layer to the terminal electrode through the insulation layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the hole diameter of connection holes is reduced, then signal integrity and power integrity are improved, but manufacturing precision requirements increase
Solution Approach 1:
The hole diameter defining layer is formed in advance before the connection holes are created. This preliminary structure pre-establishes the exact hole diameter requirements, allowing subsequent drilling or etching processes to follow a predetermined precise path, thereby achieving small hole diameters with controlled manufacturing precision
Solution Approach 2:
The hole diameter defining layer acts as an intermediary element between the insulation layer and the connection holes. It serves as a mask or template that mediates the formation of connection holes, ensuring they achieve the desired small diameter while maintaining manufacturing feasibility
2Temperature
If the hole diameter of connection holes is reduced, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The device is segmented into distinct functional layers: the hole diameter defining layer, the insulation layer, and the connection holes. This segmentation allows each component to perform its specific function independently - the defining layer controls geometry, the insulation layer provides electrical isolation, and the connection holes enable thermal and electrical connectivity, thereby managing heat dissipation without proportionally increasing overall device complexity
3Reliability
If the hole diameter of connection holes is reduced, then power integrity is improved, but ease of manufacture decreases
Solution Approach 1:
By forming the hole diameter defining layer before creating connection holes, the patent establishes precise dimensional constraints in advance. This preliminary action guides subsequent manufacturing steps, making it easier to achieve consistent small hole diameters across production batches, thereby improving power integrity without excessively complicating the manufacturing process
Data Source
AI summary
An electronic component embedded module may include a hole diameter defining layer, an electronic component, and an insulation layer. The hole diameter defining layer may include an inner wall, an outer wall, a front surface intersecting with the inner wall and the outer wall, and a rear surface. The electronic component may include a first terminal surface facing the rear surface of the hole diameter defining layer, and a first terminal electrode on the first terminal surface. The insulation layer is between the first terminal surface and the rear surface, covers the outer wall, and includes a step with respect to the front surface around the front surface. A connection hole may extend from the inner wall of the hole diameter defining layer to the first terminal electrode through the insulation layer.