Embedded Electronics Module With Through-Vias for Heat and Reliability
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Solution Overview
Problem
Existing electronic modules face challenges in accommodating new specifications of WBG semiconductors and applications like e-mobility, particularly in maintaining high operational reliability and dissipating heat effectively while minimizing thermally induced mechanical stresses.
Innovation Solution
An electronic module design featuring a carrier substrate partially embedded in an encapsulation with direct electrical connections via through-holes, allowing for a compact structure with minimized component distances and reduced parasitic inductances, utilizing a metal-ceramic substrate with structured metallization layers and a cooling structure for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the carrier substrate is embedded in the encapsulation with through-holes for direct electrical connection, then the distance between components is reduced and parasitic inductances are minimized, but the manufacturing complexity and assembly precision requirements increase
Solution Approach 1:
The patent transitions from planar conductor tracks on the carrier substrate to three-dimensional vertical connections through vias in the encapsulation. This dimensional change allows electrical connections to pass through the encapsulation body, reducing the lateral distance between components while enabling direct bonding to the outside of the encapsulation.
Solution Approach 2:
The encapsulation serves as an intermediary structure that not only protects the carrier substrate but also provides through-holes for direct electrical connections. The second metallization layer on the outer side of the encapsulation acts as a mediator, enabling direct bonding to external components while maintaining the protective encapsulation structure.
2Reliability
If the second metallization layer is provided on the outer side of the encapsulation for direct bonding, then the switching behavior and control efficiency are improved, but the device complexity increases
Solution Approach 1:
The encapsulation performs multiple functions: it protects the carrier substrate, provides structural support, and enables direct electrical connections through its through-holes. The second metallization layer on the outer side serves dual purposes as both a connection terminal and a bonding surface, reducing the need for additional external connection structures.
Solution Approach 2:
The patent merges the encapsulation function with the connection function by integrating through-holes directly into the encapsulation structure. The carrier substrate, encapsulation, and metallization layers are combined into an integrated module where the encapsulation itself provides the connection pathway, eliminating the need for separate connection elements.
3Strength
If the carrier substrate is at least partially embedded in the encapsulation, then the mechanical stability and heat dissipation are improved, but the assembly process complexity increases
Solution Approach 1:
The carrier substrate is pre-structured with conductor tracks and metallization layers before being embedded in the encapsulation. The encapsulation is designed with pre-formed through-holes that align with the substrate's connection points, allowing for straightforward assembly without complex post-embedding modifications.
Solution Approach 2:
The module uses a composite structure combining the carrier substrate (likely metal-ceramic for thermal management) with the encapsulation material (likely polymer or ceramic). This composite construction provides both mechanical stability and heat dissipation pathways while allowing the different materials to be joined through standard embedding processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances operational reliability and heat dissipation, reducing thermally induced mechanical stresses and improving control efficiency of components, while minimizing material costs and assembly complexity.
Implementation Method 1
dissipating heat generated on the component side as optimally as possible, preferably using a dedicated cooling structure
Implementation Method 2
avoiding thermally induced mechanical stresses in the electronic module as much as possible
Data Source
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AI summary
Electronics module (1), comprising - an encapsulation (20), - a carrier substrate (10) which is at least partially embedded into the encapsulation (20) and has a components side (25) which has a first metallization layer (15) and is arranged on the at least one first electronic component (30), wherein at least one second metallization layer (35) for at least one second electronic component (31), in particular for controlling the first electronic component (30), is provided on an outer side (A) of the encapsulation (2), wherein the encapsulation (20) has at least one plated-through hole (5) for electrical connection, in particular for direct electrical connection, of the first electronic component (30) and the second electronic component (31).