Embedded Multilayer Ceramic Part with Copper Electrodes
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Solution Overview
Problem
The challenge is to reduce manufacturing costs and improve reliability of embedded multilayer ceramic electronic parts in printed circuit boards while minimizing interconnect inductance and equivalent series inductance (ESL) by addressing issues with copper plating layers and laser processing, which are affected by glass components in the external electrodes.
Innovation Solution
The solution involves a multilayer ceramic electronic part design where external electrodes extend from end surfaces to main and side surfaces, with specific length and thickness criteria, and a copper metal layer is formed on these electrodes to enhance electrical connectivity and prevent plating solution permeation, and internal electrodes are connected to external electrodes through vias on the main surfaces, shortening the current path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a copper (Cu) plating layer is separately formed on the external electrodes, then electrical connectivity is improved, but manufacturing costs increase and reliability problems occur due to plating solution permeation
Solution Approach 1:
The patent merges the external electrode and copper plating layer into a single integrated structure. The external electrode is directly formed as a copper-based layer without requiring a separate plating process, thereby eliminating the need for additional plating solution application and avoiding reliability issues from plating solution permeation while maintaining good electrical connectivity.
Solution Approach 2:
The patent extracts the plating process from the manufacturing sequence by forming the external electrode directly as a copper-based layer during the ceramic body formation process, rather than applying a separate plating layer afterward. This eliminates the harmful plating solution permeation issue while maintaining the electrical connectivity function.
2Stability of the object's composition
If the external electrode includes glass component, then electrode integrity is improved, but laser processing for via formation becomes difficult due to laser absorption
Solution Approach 1:
The patent applies local quality by using a copper-based external electrode without glass components specifically in regions where laser processing is required (for via formation), while maintaining copper-based composition throughout the external electrode structure to ensure both laser processability and electrical functionality.
Solution Approach 2:
The patent extracts the glass component from the external electrode composition to enable effective laser processing for via formation. By removing the glass component that absorbs laser energy, the external electrode becomes compatible with laser-based via formation processes while maintaining its structural and electrical functions through the copper-based material.
3Reliability
If internal electrodes are connected to external electrodes through long current paths, then manufacturing is simpler, but equivalent series inductance (ESL) increases
Solution Approach 1:
The patent applies dimensionality change by transitioning from a conventional planar current path to a three-dimensional current path that utilizes vertical vias through the ceramic body. Internal electrodes are connected to external electrodes through vias formed in the thickness direction, creating a shortened 3D current path that reduces ESL while managing the increased structural complexity.
Solution Approach 2:
The patent applies preliminary action by pre-forming vias and planning the current path configuration during the ceramic body formation stage, rather than creating long current paths after assembly. The external electrodes are positioned and sized in advance to enable direct via connections to internal electrodes, thereby minimizing the current path length and ESL from the design phase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces manufacturing costs, improves reliability by preventing plating solution permeation, and decreases ESL by shortening the current path, resulting in enhanced performance and reliability of embedded multilayer ceramic electronic parts.
Implementation Method 1
a copper metal layer is formed on these electrodes to enhance electrical connectivity and prevent plating solution permeation
Implementation Method 2
via holes need to be formed in an upper plate and a lower plate using a laser to connect board wirings to external electrodes
Data Source
AI summary
There is provided a multilayer ceramic electronic part to be embedded in a board, including: a ceramic body including dielectric layers; first and second internal electrodes having first and second leads; and first and second external electrodes, wherein when lengths from edges of the first or second external electrode formed on first and second side surfaces of the ceramic body to points at which the first or second external electrode contacts the first and second leads are G1, lengths from the edges of the first or second external electrode formed on first and second side surfaces of the ceramic body to a corresponding end surface of the ceramic body are BW1, and lengths from the corresponding end surface of the ceramic body to points at which the first or second external electrode contacts the first and second leads are M1, 30 μm≦G1<BW1−M1 is satisfied.