Embedded Multilayer Windings for Lower-Leakage Magnetic Components
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Solution Overview
Problem
Existing embedded magnetic component devices face challenges with miniaturization and cost reduction due to the weight and size contributions of magnetic components, air bubbles in epoxy gel, and high leakage inductance, which affect isolation and coupling, leading to voltage surges and poor load regulation.
Innovation Solution
The design features an insulating substrate with multiple windings wrapped around a magnetic core, including inner and outer conductive connectors, and additional isolation layers to improve coupling and reduce leakage inductance, allowing for a more compact and efficient embedded magnetic component device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy gel is used to fill the cavity around the magnetic core, then the magnetic core is fully covered and secured, but air bubbles form in the epoxy gel during solidifying which can expand during reflow soldering and cause device failure
Solution Approach 1:
The patent removes the harmful epoxy gel filling from the cavity, extracting the problematic element that causes air bubbles. Instead of filling the cavity with epoxy gel, the invention uses a different approach where the magnetic core is secured through mechanical means or alternative materials that do not trap air bubbles during curing.
Solution Approach 2:
The patent employs a removable placeholder or temporary structure during assembly that allows for easy evacuation of air bubbles. This temporary element is removed after assembly, leaving a bubble-free cavity without requiring curing of epoxy gel that would trap bubbles.
2Ease of manufacture
If the cavity is made slightly larger than the magnetic core to allow insertion, then the magnetic core can be easily placed, but an air gap exists around the magnetic core which reduces isolation effectiveness
Solution Approach 1:
The patent applies different properties to different regions: the cavity is designed with selective filling where material is placed only in specific locations to maintain isolation without creating air gaps. This local quality approach ensures that isolation-critical areas are filled while avoiding the need for complete cavity filling that would trap air bubbles.
Solution Approach 2:
The patent uses asymmetric cavity design or asymmetric placement of isolation materials, where the cavity dimensions or filling pattern are non-uniform. This asymmetry allows for better contact and isolation in critical areas while maintaining ease of insertion, resolving the contradiction between easy assembly and effective isolation.
3Device complexity
If traditional single-layer windings are used, then the structure is simple, but leakage inductance is high which causes voltage surges and poor load regulation
Solution Approach 1:
The patent transitions from single-layer windings to multilayer windings, adding the dimensional aspect of multiple layers stacked or arranged in three-dimensional space. This dimensional change allows for better magnetic coupling and reduced leakage inductance while maintaining manufacturing feasibility through systematic trace and via arrangements across multiple substrate layers.
Solution Approach 2:
The patent implements nested winding structures where multiple winding layers are arranged concentrically or in nested patterns around the magnetic core. This nesting approach optimizes magnetic flux linkage between primary and secondary windings, reducing leakage inductance while maintaining a compact structure that doesn't significantly increase overall device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances coupling and reduces leakage inductance, enabling smaller device sizes while maintaining necessary isolation and improving load regulation and voltage stability.
Implementation Method 1
a first electrical winding that extends through the insulating substrate and around the magnetic core; a second electrical winding that extends through the insulating substrate and around the magnetic core
Data Source
AI summary
A device includes a substrate; a magnetic core in the substrate, including a hole, and divided into a first half and a second half opposite to the first half; a first winding extending through the hole and around the magnetic core; a second winding extending through the hole and around the magnetic core; and a third winding extending through the hole, around the magnetic core, and around a portion of the first winding. The first and the third windings only extend around the same half of the magnetic core. At least one first turn of the second winding extends around the second half of the magnetic core.