Embedded Multi-Stack Packaging With Cooling and Embedded Interconnects
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Solution Overview
Problem
Forming connections between substrates in semiconductor devices can cause complications, and existing packaging methods do not adequately address thermal, physical, and electrical protection of integrated circuits.
Innovation Solution
A packaging technique involving a substrate with attachment locations, multi-device packages, embedded circuits, and compute devices, along with redistribution layers and fluid cooling channels, to create a three-dimensional packaging architecture that thermally couples devices and provides electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If connections are formed between substrates to increase computation, then computational performance is improved, but packaging complexity and manufacturing difficulty increase
Solution Approach 1:
The patent embeds multiple device packages within a single substrate, creating a nested structure where packages are positioned in attachment locations on the substrate. This nesting approach allows multiple computational components to be integrated into a unified package, improving computational performance while managing packaging complexity through systematic integration.
Solution Approach 2:
The patent transitions from traditional two-dimensional substrate layouts to three-dimensional packaging by embedding packages within the substrate volume and using vertical stacking arrangements. This dimensional change enables increased computational capacity without proportionally increasing the substrate footprint, addressing the complexity-performance tradeoff.
2Productivity
If multiple devices are integrated on a single substrate, then computational capacity increases, but thermal management becomes more difficult
Solution Approach 1:
The patent divides the substrate into multiple attachment locations, each hosting separate device packages. This segmentation allows for distributed thermal management, where heat generation is spread across multiple localized regions rather than concentrated in a single area, facilitating more effective thermal control.
Solution Approach 2:
The substrate acts as an intermediary thermal management structure between the embedded device packages and the external environment. It provides thermal pathways and interfaces for heat dissipation, mediating the thermal interaction between multiple devices and enabling coordinated thermal management across the integrated package.
3Reliability
If embedded circuits are used to connect compute devices, then electrical connectivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates embedded circuits within the substrate during substrate fabrication, before the device packages are attached. This preliminary action establishes the electrical interconnection framework in advance, ensuring precise alignment and reliable connectivity without requiring high-precision alignment during the package attachment process.
Solution Approach 2:
The embedded circuits within the substrate serve as intermediary connection elements between the compute devices on different attachment locations. These pre-formed conductive pathways mediate the electrical connections, eliminating the need for complex post-attachment wiring and reducing manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances computational performance by allowing efficient electrical and thermal management of integrated circuits, reducing computational burden on multi-device packages, and providing robust protection.
Implementation Method 1
a heat conduit is formed between the first attachment location and a surface of the substrate, and the heat conduit may thermally couple the first multi-device package to the fluid cooling channel
Implementation Method 2
a fluid cooling channel is formed within the substrate
Data Source
AI summary
Disclosed herein are methods, systems and devices including a substrate having a first attachment location and a second attachment location, a first multi-device package located within the first attachment location, a first embedded circuit located within the second attachment location, and a first compute device located on the substrate and at least partially over the first attachment location and the second attachment location.