Embedded Optical Connector Die for Photonic Assembly

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Solution Overview

Problem

Existing photonic integrated circuits (PICs) face challenges in efficiently channeling laser light to optical devices within a compact universal photonic engine (COUPE) architecture, which limits their integration and performance.

Innovation Solution

A composite die structure is formed by bonding an electronic integrated circuit (EIC) die and an embedded optical connector die to a photonic integrated circuit (PIC) die, with a dielectric matrix surrounding the EIC and optical connector dies. The embedded optical connector die includes an optical deflector that can deflect photons between vertically and horizontally extending beam paths, enabling flexible light channeling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If an optical connector die is embedded within the COUPE die structure, then the integration and versatility of optical components is improved, but the device complexity increases

Engineering Contradiction:

Improveoptical coupling versatilityVSAvoiddie structure complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The optical connector die is embedded within the COUPE die structure, with the connector die containing waveguides and optical elements nested within the larger photonic engine architecture. This nesting approach enables versatile optical coupling while managing complexity through hierarchical integration.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The COUPE die is segmented into functional regions including the optical connector die, photonic integrated circuit regions, and electronic integrated circuit regions. This segmentation allows each component to be optimized independently while contributing to the overall versatile integration.

Inventive Principle:

Principle #1Segmentation

2Adaptability or versatility

If an optical deflector is used to channel light between vertically and horizontally extending beam paths, then the light channeling flexibility is improved, but the device complexity increases

Engineering Contradiction:

Improvelight channeling flexibilityVSAvoidoptical path complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The optical deflector enables dynamic routing of light between vertical and horizontal beam paths, allowing the optical system to adapt its configuration based on operational requirements. This dynamic light channeling provides flexibility without requiring separate dedicated paths for each mode.

Inventive Principle:

Principle #15Dynamics

3Adaptability or versatility

If multiple dies (EIC die, optical connector die, PIC die) are bonded together to form a composite die, then the integration capability is improved, but the manufacturing complexity increases

Engineering Contradiction:

Improveintegration capabilityVSAvoidfabrication complexity

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

Multiple dies including the EIC die, optical connector die, and PIC die are bonded together to form a composite die structure. This merging approach consolidates multiple functions into a single integrated unit, improving overall integration capability while requiring sophisticated bonding processes.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration provides a versatile optical conduit within the COUPE die, enabling diverse coupling modes for optical fibers and enhancing the integration and performance of photonic components.

Implementation Method 1

The embedded optical connector die includes an optical deflector that can deflect photons between vertically and horizontally extending beam paths

Methodology Applied

Scientific EffectOptical reflection: Reflection

Implementation Method 2

The embedded optical connector die includes an optical deflector that can deflect photons between vertically and horizontally extending beam paths

Methodology Applied

Scientific EffectOptical refraction: Refraction

Implementation Method 3

A composite die structure is formed by bonding an electronic integrated circuit (EIC) die and an embedded optical connector die to a photonic integrated circuit (PIC) die

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS20250052962A1Photonic assembly including an embedded optical connector die and methods for forming the same

Publication Date: 2025.02.13 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A photonic assembly includes a composite die. The composite die includes: a photonic integrated circuits (PIC) die including waveguides and photonic devices therein; an electronic integrated circuits (EIC) die including semiconductor devices therein; and an embedded optical connector die contacting a top surface of the PIC die and laterally spaced from the EIC die.