Embedded Optical Die Packaging for Shorter Optical Paths
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Solution Overview
Problem
Semiconductor packages with surface-mounted optical dies face challenges such as long optical path lengths, increased difficulty in alignment and manufacturability, and higher costs due to the need for direct optical fiber coupling, which complicates high-speed communications between electronic devices.
Innovation Solution
The integration of optical dies within the semiconductor package, coupled with an optical waveguide and fiber, where the optical die is embedded in a cavity and aligned with a waveguide using epoxy, allowing for efficient optical coupling and reduced optical path lengths, thereby simplifying alignment and manufacturability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical dies are surface-mounted on the semiconductor package, then optical fiber coupling can be achieved, but optical path lengths become long and alignment difficulty increases
Solution Approach 1:
The optical die is embedded within the semiconductor package substrate, merging the optical component with the package structure itself. This integration eliminates the need for separate surface mounting and reduces the optical path length by positioning the optical die closer to the optical fiber coupling point within the package interior.
Solution Approach 2:
The optical die is nested within a cavity formed in the semiconductor package substrate. This nesting approach allows the optical die to be housed inside the package structure, reducing the external optical path length and improving coupling efficiency while maintaining a compact form factor.
2Reliability
If optical dies are surface-mounted on the semiconductor package, then optical fiber coupling can be achieved, but the number of optical interfaces increases and manufacturability deteriorates
Solution Approach 1:
The optical die embedding process is merged with the semiconductor package fabrication process. The cavity is formed during substrate processing, and the optical die is integrated within the same manufacturing flow, reducing the number of separate assembly steps and interfaces required for optical fiber coupling.
Solution Approach 2:
The cavity for housing the optical die is formed preliminarily during the semiconductor package substrate fabrication process, before final assembly. This preliminary preparation of the embedding cavity simplifies subsequent optical die integration and reduces the complexity of the overall manufacturing process.
3Reliability
If optical dies are surface-mounted on the semiconductor package, then optical fiber coupling can be achieved, but device complexity and cost increase
Solution Approach 1:
The optical die embedding approach merges multiple functions into a single integrated structure. The semiconductor package substrate simultaneously provides mechanical support, electrical interconnection, and optical coupling pathways, reducing the overall device complexity compared to separate surface-mounted optical components requiring additional mounting structures and alignment mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces optical coupling losses, minimizes the number of optical interfaces, enhances manufacturability, and optimizes the form factor and cost of semiconductor packages, enabling more efficient optical signaling compared to traditional surface-mounted solutions.
Implementation Method 1
the optical die is embedded in a cavity and aligned with a waveguide using epoxy, allowing for efficient optical coupling
Data Source
AI summary
Semiconductor package with one or more optical die(s) embedded therein is disclosed. The optical die(s) may have one or more overlying interconnect layers. Electrical contact to the optical die may be via the one or more overlying interconnect layers. An optical waveguide may be disposed next to the optical die and embedded within the semiconductor package. An optical fiber may be optically coupled to the optical waveguide.