Embedded Optical Die Package With Waveguide-Coupled Fiber
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Solution Overview
Problem
Existing semiconductor packages with optical die face challenges in managing long optical path lengths, multiple optical interfaces, and manufacturability issues due to surface-mounted optical components.
Innovation Solution
The integration of optical die within the semiconductor package, coupled with an optical waveguide and fiber, is achieved by forming a cavity and using optical epoxy to create a cladding and core structure for total internal reflection, with electrical contacts and interconnect layers for alignment and encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical die are assembled onto the surface of a semiconductor package, then optical signaling can be achieved, but optical path length increases and manufacturing complexity increases
Solution Approach 1:
The patent merges the optical die with the semiconductor package substrate by embedding the optical die within recesses formed in the substrate. This integration eliminates the need for separate surface mounting of optical components, thereby reducing optical path length while maintaining optical signaling functionality. The optical die are positioned in close proximity to the waveguide structures directly within the substrate, achieving compact integration.
Solution Approach 2:
The patent implements nesting by placing optical die within recesses that are formed inside the semiconductor package substrate. The optical die are nested within the substrate structure rather than being mounted on the external surface, and waveguide structures are nested within the substrate to guide light from the optical die. This nested configuration reduces the overall optical path length and minimizes the number of optical interfaces.
2Reliability
If optical die are assembled onto the surface of a semiconductor package, then optical signaling can be achieved, but the number of optical interfaces increases
Solution Approach 1:
The patent combines multiple optical components and functions within a single integrated structure. The waveguide structures are formed directly within the semiconductor package substrate, eliminating the need for separate coupling components at the substrate surface. This merging of optical die, waveguides, and substrate structures reduces the total number of optical interfaces and associated alignment requirements.
Solution Approach 2:
By nesting optical die within recesses in the substrate and embedding waveguide structures within the substrate, the patent reduces the number of external optical interfaces. The optical paths are contained within the substrate structure, minimizing the number of times light must cross between different materials and components.
3Reliability
If optical die are assembled onto the surface of a semiconductor package, then optical signaling can be achieved, but manufacturability issues arise
Solution Approach 1:
The patent employs preliminary actions by forming recesses in the semiconductor package substrate before assembling the optical die. The waveguide structures are formed within the substrate in advance, and the recesses are prepared to receive the optical die in predetermined positions. This preliminary structuring of the substrate simplifies the subsequent assembly process and improves manufacturability by enabling batch processing and standardized assembly procedures.
Solution Approach 2:
The integration of optical die within the substrate structure allows for combined fabrication processes where optical and electronic components can be manufactured together in the same package. This merging of manufacturing processes reduces the number of separate assembly steps and improves overall manufacturability compared to surface mounting optical components that would require separate handling and alignment procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces optical path length, minimizes coupling losses, enhances manufacturability, and lowers costs by avoiding surface mounting, while maintaining efficient optical signaling.
Implementation Method 1
using optical epoxy to create a cladding and core structure for total internal reflection
Data Source
AI summary
Semiconductor package with one or more optical die(s) embedded therein is disclosed. The optical die(s) may have one or more overlying interconnect layers. Electrical contact to the optical die may be via the one or more overlying interconnect layers. An optical waveguide may be disposed next to the optical die and embedded within the semiconductor package. An optical fiber may be optically coupled to the optical waveguide.