Embedded Optical Element Structure for Stable Optoelectronic Chips
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Solution Overview
Problem
Existing optoelectronic semiconductor devices face challenges in achieving high efficiency and ensuring eye safety, particularly when attaching optical elements to semiconductor chips, which often require air gaps or evacuated regions and are prone to mechanical instability and adhesive bonding issues.
Innovation Solution
The semiconductor device integrates the semiconductor chip and optical element within a potting body, encapsulating an air gap or evacuated region, and uses a structured optical element with a contiguous optically effective area that covers the radiation exit area, ensuring reliable attachment and mechanical stability while maintaining functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If optical elements are attached to semiconductor chips using adhesive bonding with air gaps or evacuated regions, then the optical functionality is maintained, but the mechanical stability and reliability deteriorate
Solution Approach 1:
The patent merges the optical element and semiconductor chip into a single integrated component where the optical element is formed directly on the chip surface. This eliminates the need for separate attachment processes and adhesive bonding, thereby improving mechanical stability while maintaining optical functionality through the integrated structure.
Solution Approach 2:
The patent extracts and eliminates the air gap or evacuated region between the optical element and semiconductor chip by forming the optical element directly on the chip surface. This removal of the intermediate space prevents mechanical instability associated with adhesive bonding while preserving the necessary optical path through the integrated design.
2Adaptability or versatility
If optical elements are attached to semiconductor chips, then optical functionality is achieved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines the optical element formation process with the semiconductor chip manufacturing process, eliminating the need for separate attachment steps. This integration reduces device complexity by removing intermediate components and processes while maintaining full optical functionality through the unified structure.
Solution Approach 2:
The patent performs preliminary formation of the optical element during the semiconductor chip manufacturing process itself, before final assembly. This preliminary action eliminates the need for subsequent attachment operations, reducing manufacturing complexity and improving process efficiency while ensuring optical functionality is built-in from the start.
3Object-affected harmful factors
If the optically effective area is structured to cover the radiation exit area, then eye safety is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent merges the formation of the optically effective area with the formation of the radiation exit area in the same manufacturing process step. This simultaneous formation ensures perfect alignment between the two areas without requiring separate alignment operations, thereby achieving eye safety through complete coverage while avoiding increased manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a compact, cost-effective, and mechanically robust semiconductor device with enhanced eye safety by ensuring that nearly all emitted radiation passes through the optically effective area, preventing separation of the optical element from the chip without damaging the housing.
Implementation Method 1
The semiconductor layer sequence comprises at least one active zone which, in operation, is configured to generate radiation by means of electroluminescence
Implementation Method 2
the optical element is a diffractive optical element, or DOE
Implementation Method 3
If the optical element is an optic made of a metamaterial, the structure sizes can be significantly smaller than the wavelength. For example, a metamaterial comprises a negative refractive index
Implementation Method 4
the potting body has a radiation-absorbing effect to reduce scattered radiation
Data Source
AI summary
In an embodiment, the optoelectronic semiconductor device comprises an optoelectronic semiconductor chip for emitting a radiation. An optical element is disposed downstream of the semiconductor chip. The semiconductor chip and the optical element are embedded in a potting body. The optical element comprises a structured, contiguous and optically effective area, which is located inside the optical element directly at an optical contrast region, preferably an evacuated or gas-filled cavity. The optically effective area completely covers a radiation exit area of the semiconductor chip.