Embedded Optical Interposer Layout for Low-Loss Chip Interconnects
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Solution Overview
Problem
Existing technologies face challenges in integrating optical and electrical components efficiently within semiconductor devices, limiting the size and performance of optical interconnects due to spatial constraints and the need for mixed loss waveguides.
Innovation Solution
Embedding an optical interposer within an interposer that includes waveguides, allowing for optical interconnections, and using dielectric-to-dielectric and metal-to-metal bonding processes to integrate semiconductor devices, enabling larger optical interposer designs with ultra-low loss waveguides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If optical and electrical components are integrated within semiconductor devices, then signal transmission capability is improved, but spatial constraints limit the size and performance of optical interconnects
Solution Approach 1:
The patent embeds an optical interposer within a larger interposer structure, creating a nested configuration where the optical interposer is positioned inside the electrical interposer. This nesting approach allows optical components to be integrated within the semiconductor device footprint without increasing the overall device area, thereby improving signal transmission capability while maintaining spatial constraints.
2Ease of manufacture
If mixed loss waveguides are used in existing technologies, then integration is simplified, but signal loss increases
Solution Approach 1:
The patent divides the interposer structure into distinct segments: an optical interposer region with ultra-low loss waveguides and an electrical interposer region with electrical components. This segmentation allows each region to be optimized for its specific function - the optical interposer uses low-loss waveguides for signal transmission while the electrical interposer handles electrical interconnections, thereby reducing overall signal loss while maintaining integration capability.
Data Source
AI summary
Optical devices and methods of manufacture are presented in which optical interposers are embedded within interposers. In some embodiments a method includes embedding an optical interposer into an interposer with one or more waveguides, with or without other semiconductor devices, and then bonding one or more semiconductor devices onto the interposer.