Embedded ASIC and Optical Component Packaging for EMI Mitigation
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Solution Overview
Problem
Traditional optical packages for proximity sensors are susceptible to mechanical shock and external electromagnetic interference (EMI) due to their configuration, which mounts photodetectors and light sources on flex circuits connected to separate ends, leading to instability and interference issues.
Innovation Solution
The optical packages embed a controller chip along with photodetectors and emitters in a single package, using redistribution layers, printed circuit boards, and laser direct structuring for electrical connections, allowing for a compact and shielded design that mitigates mechanical shock and EMI, and enables standalone testing and calibration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If photodetectors and light sources are mounted on flex circuits at separate ends, then the package can be compact, but the device becomes susceptible to mechanical shock and EMI
Solution Approach 1:
The patent combines the controller chip, photodetectors, and light sources into a single integrated package structure. All components are mounted on the same substrate (PCB or RDL) rather than being separated on flex circuits, which eliminates the mechanical shock susceptibility caused by long flex circuit connections while maintaining compact dimensions.
2Volume of moving object
If photodetectors and light sources are mounted on flex circuits at separate ends, then the package can be compact, but the device becomes susceptible to external electromagnetic interference
Solution Approach 1:
By integrating all optical components and the controller chip into a single package with short internal connections, the patent minimizes the antenna effect and electromagnetic radiation paths that would otherwise exist in extended flex circuit configurations. The compact integrated structure reduces EMI susceptibility while maintaining small package size.
3Reliability
If components are embedded in a single package, then mechanical robustness and EMI suppression are enhanced, but the electrical routing becomes more complex
Solution Approach 1:
The patent replaces traditional mechanical wire bonding and flex circuit connections with laser direct structuring (LDS) technology. LDS enables direct laser writing of conductive traces on the substrate, eliminating the need for separate routing layers and reducing the complexity of electrical interconnections while maintaining mechanical robustness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides enhanced mechanical robustness and EMI suppression, improving the reliability and performance of proximity sensors by embedding components within a single package and allowing for efficient electrical routing, thereby reducing interference and shock susceptibility.
Implementation Method 1
laser direct structuring (LDS) techniques are utilized for electrical wiring connections
Data Source
AI summary
Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.