Embedded Optical Packaging Structure for EMI Shielding and Heat Dissipation
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Solution Overview
Problem
Existing embedded packaging technologies face challenges with metal wire rods' limited electrical conductivity, susceptibility to electromagnetic interference, signal distortion, and difficulties in integrating optical communication devices due to high processing requirements and limited heat dissipation.
Innovation Solution
An embedded packaging structure with optical communication devices embedded in a substrate, featuring a blocking wall and metal heat dissipation layer, and a manufacturing method that includes forming insulating and wiring layers with metal via-columns to enhance signal transmission and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal wire rods are used for signal transmission, then electrical conduction is achieved, but electromagnetic interference susceptibility increases and signal transmission speed is limited
Solution Approach 1:
The patent replaces metal wire rods (electrical conduction system) with optical waveguides (optical conduction system) for signal transmission. This substitution eliminates electromagnetic interference susceptibility while enabling higher signal transmission speeds, directly resolving the contradiction between reliability and electromagnetic interference vulnerability.
2Reliability
If optical communication devices are embedded in substrate, then electromagnetic interference is reduced, but processing difficulty increases due to high level and angle requirements
Solution Approach 1:
The patent forms the optical waveguide structure within the substrate before embedding the optical communication device. This preliminary formation of the optical path ensures proper alignment and reduces processing difficulty during device embedding, while maintaining the electromagnetic interference shielding benefits of embedded packaging.
3Productivity
If optical communication devices are embedded in substrate, then integration density is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent segments the substrate into multiple embedding regions with individual optical communication devices. Each device is embedded in its own designated area with sufficient spacing, allowing independent heat dissipation pathways while maintaining high integration density. This segmentation prevents heat accumulation that would occur in densely packed configurations.
4Object-affected harmful factors
If transparent layer is added to protect working face, then interference protection is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the protective function with the substrate structure itself. The substrate serves both as the mounting platform for the optical communication device and as the protective enclosure, eliminating the need for separate transparent protective layers while maintaining interference protection and simplifying the overall packaging structure.
Data Source
AI summary
An embedded packaging structure according to an embodiment of the present disclosure includes an optical communication device embedded in a substrate, and a blocking wall surrounding the working face opening. The optical communication device may include a working face for emitting light or receiving light. The working face may be revealed by a working face opening from a first surface of the substrate. The blocking wall may extend beyond the first surface in a direction away from the first surface.