Embedded Optical Element Package Using Thermocouple Heat Recovery

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Solution Overview

Problem

Conventional optical element packages, such as those using LEDs, face issues with heat dissipation and power consumption, as they require significant energy to maintain high power levels and are prone to degradation due to heat, while waste heat is not effectively reused.

Innovation Solution

An embedded optical element package module utilizing a thermocouple with a metal circuit board, heat dissipation fins, and a thermocouple that converts waste heat into electric energy, which is then used to power the optical elements, minimizing power consumption and extending their lifespan.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If optical elements are mounted on the upper surface of the metal board and protrude from the surface, then optical elements can be easily accessed and installed, but the package becomes vulnerable to external impact damage

Engineering Contradiction:

Improveease of installationVSAvoidimpact resistance

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The optical elements are embedded within recesses formed on the upper surface of the metal board, creating a nested structure where the optical elements are housed inside the board rather than protruding. This protects them from external impact while maintaining accessibility for installation and maintenance.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Illumination intensity

If high power is supplied to optical elements to achieve higher light output, then illumination intensity increases, but heat generation increases causing degradation and reduced lifespan

Engineering Contradiction:

Improvelight outputVSAvoidlifespan

Core Design Contradiction:

Illumination intensityVSReliability

Solution Approach 1:

The waste heat generated by the high-power optical elements is captured by the thermocouple device, which converts this harmful thermal energy into useful electrical energy. This electricity is then used to power the optical elements, transforming the degradation-causing heat into a beneficial resource that extends system lifespan.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The system generates its own power supply by converting its own waste heat through the thermocouple. The electrical energy produced from the heat dissipation process is fed back to power the LED driver circuit and illuminate the optical elements, creating a self-sustaining system that reduces external power requirements and minimizes thermal degradation.

Inventive Principle:

Principle #25Self-service

3Temperature

If conventional heat dissipation methods are used, then heat is removed from optical elements, but the dissipated heat is wasted and does not contribute to system operation

Engineering Contradiction:

Improveheat dissipationVSAvoidenergy waste

Core Design Contradiction:

TemperatureVSLoss of energy

Solution Approach 1:

The thermocouple device is integrated into the heat dissipation path, converting the waste heat that would otherwise be lost into useful electrical energy. The heat flows from the optical elements through the thermocouple to the heat dissipation fins, and during this process, the thermocouple generates electricity that powers the system, turning energy waste into energy production.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The module efficiently dissipates heat from high-power optical elements, reuses waste heat as a power source, and reduces energy consumption, thereby maximizing energy efficiency and extending the lifespan of the optical elements.

Implementation Method 1

a heat dissipation plate installed at the lower end of the metal circuit board and provided with a plurality of heat dissipation fins to dissipate heat, and a thermocouple arranged in the shape of a checkerboard on the heat dissipation fins, converting heat energy transmitted from the optical elements into thermoelectromotive force, and generating thermoelectric current at junctions where two kinds of metals having different thermal conductivities intersect

Methodology Applied

Scientific EffectSeebeck effect: Seebeck Effect

Implementation Method 2

a heat dissipation plate installed at the lower end of the metal circuit board and provided with a plurality of heat dissipation fins to dissipate heat

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

a heat dissipation plate installed at the lower end of the metal circuit board and provided with a plurality of heat dissipation fins to dissipate heat

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 4

a metal circuit board formed of a metal having thermal conductivity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8975504B2Embedded optical element package module using a thermocouple

Publication Date: 2015.03.10 SDS

AI summary

An embedded optical element package module uses a thermocouple, which increases the optical output efficiency of an optical element, dissipates high-temperature heat generated by the optical element having high output to prevent degradation, converts waste heat into electrical energy, and supplies the electrical energy as a power source for the optical element to reutilize resources, thereby reducing the amount of power consumed by the optical element and minimizing costs.