Embedded Optical Waveguide Packaging for Simpler Photonics Interconnects
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Solution Overview
Problem
Current optical interconnect architectures using a V-groove approach for connecting photonics dies to a package substrate are complex, leading to low yields and high development costs due to assembly operations like epoxy underfill processes and package warpage.
Innovation Solution
Embedding optical waveguides within the package substrate, eliminating the need for overhanging photonics dies and simplifying assembly by using standard packaging processes, with options for organic or glass substrates and discrete waveguides for improved optical transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a V-groove approach is used to connect photonics dies to package substrate, then optical connections can be established, but assembly complexity increases and yield decreases
Solution Approach 1:
The patent extracts the photonics die from the overhanging configuration and repositions it entirely within the package substrate footprint. This eliminates the need for V-groove structures and complex assembly operations while maintaining optical connection functionality through alternative coupling methods.
Solution Approach 2:
Instead of having the photonics die overhang the substrate and using V-grooves to accommodate it, the patent inverts the approach by having the substrate fully contain the photonics die footprint. This reversal simplifies the assembly process and eliminates the associated complexity.
2Reliability
If overhanging photonics dies are used with V-grooves, then optical interconnects can be formed, but manufacturing cost increases due to low yield
Solution Approach 1:
The patent removes the problematic overhanging die configuration and V-groove structures, replacing them with a fully contained die layout that enables standard packaging processes. This extraction of the non-standard features eliminates the yield issues and associated manufacturing costs.
Solution Approach 2:
The patent changes the geometric parameter of die placement from overhanging to fully contained within substrate footprint. This parameter change enables the use of mature standard packaging processes, improving manufacturability and reducing costs.
3Strength
If epoxy underfill processes are used with overhanging dies, then mechanical support is provided, but process maturity is low and yield decreases
Solution Approach 1:
The patent extracts the requirement for epoxy underfill processes by eliminating the overhanging die configuration that necessitated them. With the die fully contained within the substrate footprint, standard mechanical support methods can be used, leveraging mature processes and improving yield.
4Temperature
If integrated heat spreader is attached with overhanging die, then thermal management is achieved, but assembly complexity increases
Solution Approach 1:
The patent removes the overhanging die configuration that complicated IHS attachment. By containing the die within the substrate footprint, the IHS can be attached using standard procedures, reducing assembly complexity while maintaining thermal management functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces assembly complexity, enhances yield, and lowers development costs while maintaining high bandwidth and noise tolerance, enabling efficient optical signal transmission.
Implementation Method 1
an optical waveguide embedded in the package substrate. The optical waveguide has a first end below the photonics die and a second end at the edge of the package substrate
Implementation Method 2
An angled surface at the first end of the optical waveguide reflects light to optically couple the optical waveguide to the bottom surface of the photonics die
Data Source
AI summary
Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate.