Embedded Optics Thermoplastic Filling Without Connector Stress
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Solution Overview
Problem
Existing manufacturing processes for embedded optics, such as injection molding and 3D printing, face challenges with filling closed cavities and experiencing thermal gradients, leading to incomplete filling, mechanical stress on connectors, and rough finishes.
Innovation Solution
A method using a thermostatted open cavity system with a temperature control system, an autonomous thermoplastic material dispensing unit, and a controlled atmosphere gas unit to fill and cool thermoplastic material around photonic components, ensuring optimal fluidity and minimizing mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If injection molding is used to fill closed cavities with thermoplastic material, then the cavity can be filled, but thermal gradients cause incomplete filling and mechanical stress on connectors
Solution Approach 1:
The patent changes the temperature parameter by maintaining the thermoplastic material above its melting point throughout the filling process using a thermostatted open cavity. This prevents thermal gradients and maintains material fluidity, allowing complete filling without mechanical stress on connectors.
Solution Approach 2:
The patent uses an open cavity configuration that allows dynamic temperature control and material flow adjustment. The cavity can be thermostatted to maintain optimal conditions during filling, and the open structure permits easier material distribution compared to closed cavity injection molding.
2Manufacturing precision
If pressure is applied to melt and dispense thermoplastic material into closed cavities, then the material can fill the cavity, but the pressure gradient causes thermal gradients and rough finishes
Solution Approach 1:
The patent eliminates pressure gradients by using gravity-fed material dispensing into an open cavity maintained at controlled temperature. This approach maintains uniform temperature throughout the material and cavity, preventing thermal gradients and producing smooth surface finishes without requiring high pressure.
Solution Approach 2:
The thermostatted open cavity acts as an intermediary between the material source and final product. It maintains optimal temperature conditions during filling, allowing smooth material flow and surface formation without the harmful effects of pressure-induced thermal gradients.
3Manufacturing precision
If thermoplastic material is heated and pressurized for injection molding, then the material reaches the cavity, but cooling causes thermal stress and rough finishes
Solution Approach 1:
The patent maintains the thermoplastic material above its melting point throughout the filling process using cavity thermostating. This eliminates the heating-cooling cycle of traditional injection molding, preventing thermal stress and producing smooth surface finishes.
Solution Approach 2:
The patent maintains continuous thermal conditions by keeping both the material and cavity at controlled temperatures above the melting point during filling. This continuous thermal state eliminates the thermal shock and stress associated with rapid cooling in conventional processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves smooth filling of cavities without mechanical stress on connectors, maintaining the fluidity of thermoplastic material throughout the process, and results in high-precision embedded optics with improved surface finishes.
Implementation Method 1
melting the thermoplastic material, positioning the physical carrier with the photonic component on the support structure, such that the photonic component is inside the thermostatted cavity and the thermostatted cavity being partially open, filling the thermostatted cavity with the molten thermoplastic material in a filling unit, where the thermostatted cavity is kept at a temperature Tc greater than Tm during the step of filling
Implementation Method 2
once the thermostatted cavity is filled, cooling the thermostatted cavity below the Tm
Data Source
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AI summary
The invention of the method for manufacturing an embedded optics in photonic components relates to a method for manufacturing an embedded optics that uses thermoplastic material to generate these optics, a thermostatted system for manufacturing the same, an open thermostatted containment structure or cavity, an autonomous thermoplastic material dispensing unit, a controlled temperature and atmosphere gas unit, and a cooling unit. The invention also relates to a system for manufacturing an embedded optics with a continuous thermal process.