Embedded Package Antenna With High-k Dielectric for Miniaturization
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Solution Overview
Problem
Conventional antennas in integrated semiconductor devices face challenges due to size reduction constraints, leading to limited performance and capability in wireless applications.
Innovation Solution
The proposed solution involves embedding an antenna structure within the encapsulation layer of a semiconductor package, utilizing a high-k dielectric bulk interposed between emitter and ground structures to enhance performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If antenna size is reduced to meet miniaturization requirements, then device integration is improved, but antenna performance deteriorates
Solution Approach 1:
The patent changes the dielectric parameter by introducing a high-k dielectric material with dielectric constant greater than 3.0 (preferably greater than 10) into the antenna structure. This parameter change allows the antenna to maintain resonant frequency and radiation performance while occupying a smaller volume, directly resolving the contradiction between size reduction and performance maintenance
Solution Approach 2:
The patent employs composite material structure by combining high-k dielectric material with conductive materials (emitter and ground structures) to form an integrated antenna system. The high-k dielectric serves multiple functions: enhancing electric field confinement, increasing capacitance, and enabling miniaturization while maintaining performance, thus resolving the size-performance tradeoff
2Ease of manufacture
If conventional antenna designs are used in integrated circuits, then manufacturing simplicity is maintained, but performance capability is limited
Solution Approach 1:
The patent merges the antenna structure with the semiconductor package encapsulation layer by embedding the high-k dielectric and conductive structures within the encapsulation material. This integration allows the antenna to be manufactured simultaneously with the package encapsulation process, maintaining manufacturing simplicity while achieving enhanced performance through the high-k dielectric material
Solution Approach 2:
The encapsulation layer serves dual functions: protecting the semiconductor die and serving as the antenna structure itself. The high-k dielectric material in the encapsulation layer simultaneously provides electrical insulation and enhances antenna performance through increased dielectric constant, enabling one component to fulfill multiple functions without adding manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces package size, improves transmission and receiving performance, and allows for greater design flexibility, effectively addressing the limitations of conventional antennas.
Implementation Method 1
The at least one antenna structure includes a dielectric bulk, and a dielectric constant of the dielectric bulk is higher than a dielectric constant of the encapsulation layer
Data Source
AI summary
A semiconductor package includes a semiconductor die, an encapsulation layer and at least one antenna structure. The encapsulation layer laterally encapsulates the semiconductor die. The at least one antenna structure is embedded in the encapsulation layer aside the semiconductor die. The at least one antenna structure includes a dielectric bulk, and a dielectric constant of the dielectric bulk is higher than a dielectric constant of the encapsulation layer.