Embedded Package Block Fabrication via Pre-formed Conductive Posts
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Solution Overview
Problem
The existing semiconductor packaging methods, particularly the laser drilling process for forming through holes, are time-consuming, damage copper foils, lead to residue accumulation, uneven hole surfaces, and heat-affected zones, which affect the quality and miniaturization of semiconductor packages.
Innovation Solution
The method involves fabricating package blocks with conductive posts first and then encapsulating them with an encapsulant, eliminating the need for laser drilling, cleaning, and electroplating processes, allowing for improved electrical transmission and miniaturization by positioning conductive posts closer to the electronic element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser drilling process is used to form through holes, then through holes can be formed in the encapsulant, but the copper foil is damaged and the process is time-consuming
Solution Approach 1:
The conductive posts are pre-formed on the carrier before the encapsulant is molded. This preliminary formation of conductive structures eliminates the need for subsequent laser drilling and electroplating operations, significantly reducing fabrication time while ensuring high precision through proper positioning and bonding
Solution Approach 2:
The conductive posts are extracted from the encapsulant formation process and formed separately on the carrier first. This separation allows the conductive posts to be prepared independently with high precision, then integrated into the final package structure without requiring damage to the copper foil or time-consuming drilling operations
2Manufacturing precision
If laser drilling process is used to form through holes, then through holes can be formed, but residue accumulates on the bottom of the holes requiring cleaning processes
Solution Approach 1:
The conductive posts are formed separately on the carrier before encapsulation, extracting the conductive structure formation from the encapsulant drilling process. This eliminates residue accumulation issues entirely, as the conductive posts are bonded to the carrier surface rather than formed through drilling into the encapsulant, removing the need for cleaning steps
Solution Approach 2:
The conductive posts are preliminarily formed and bonded to the carrier before the encapsulant is molded over them. This preliminary action ensures that conductive structures are in place without requiring subsequent drilling, cleaning, or electroplating operations, thereby simplifying the overall fabrication process
3Manufacturing precision
If laser drilling process is used, then through holes can be formed, but the wall surfaces are uneven causing conductive material delamination
Solution Approach 1:
The conductive posts are extracted from the laser drilling process and formed separately on the carrier. This ensures that the carrier's copper foil surface, which is naturally smooth and clean, serves as the bonding surface for conductive posts, eliminating the uneven wall surface problem and ensuring reliable attachment
Solution Approach 2:
The conductive posts are preliminarily formed and bonded to the carrier's smooth copper foil surface before encapsulation. This preliminary bonding to a clean, flat surface ensures strong adhesion, and the subsequent encapsulation process preserves this reliable attachment without the delamination issues caused by uneven surfaces
4Volume of moving object
If laser drilling is performed close to the semiconductor element, then through holes can be formed for miniaturization, but the heat affected zone damages the semiconductor element
Solution Approach 1:
The conductive posts are extracted from the laser drilling process and formed on the carrier before encapsulation. This eliminates the heat-affected zone problem entirely, as no laser drilling is performed near the semiconductor element. The carrier-based formation allows conductive posts to be positioned close to the element without thermal damage
Solution Approach 2:
The conductive posts are preliminarily formed on the carrier in positions close to the semiconductor element before the element is mounted and encapsulated. This preliminary positioning enables miniaturization without requiring laser drilling near the element, thereby avoiding heat damage while achieving compact packaging
Data Source
AI summary
A method for fabricating an electronic package is provided, including steps of: providing a carrier having at least an electronic element and at least a package block disposed thereon, wherein the package block has a plurality of conductive posts bonded to the carrier; forming an encapsulant on the carrier for encapsulating the electronic element and the package block; and removing the carrier so as to expose the electronic element and the conductive posts from a surface of the encapsulant. As such, the invention dispenses with formation of through holes in the encapsulant for forming the conductive posts as in the prior art, thereby saving the fabrication cost.