Embedded Package Structure for Borderless Electronic Integration
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Solution Overview
Problem
Existing electronic devices with borderless designs or large function regions face challenges in efficiently integrating circuit structures and electronic elements while minimizing waste and ensuring effective electrical connectivity.
Innovation Solution
The electronic device comprises a circuit structure layer with first conductive pads, a package structure that embeds an electronic element, and function elements connected vertically through the circuit structure layer. The package structure's thickness is greater than or equal to 1.5 times the electronic element's thickness, supporting a borderless design or large function region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the package structure thickness is increased to support borderless design, then the function region can be enlarged, but the device complexity increases
Solution Approach 1:
The patent transitions from planar circuit arrangement to three-dimensional vertical stacking, enabling the circuit structure layer to be positioned above the substrate rather than alongside it. This dimensional change allows the function region to expand horizontally while the package structure thickness increases vertically, resolving the contradiction between function region area and device complexity.
Solution Approach 2:
The circuit structure layer is embedded within the package structure, with the electronic element nested inside the package structure and the circuit structure layer positioned above the substrate. This nested arrangement allows multiple functional layers to coexist in a compact vertical configuration, enabling enlarged function regions without proportionally increasing overall device complexity.
2Reliability
If electronic elements are embedded in the package structure, then electrical connectivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The package structure is formed first, creating a pre-defined embedding space with appropriate cavities and conductive pathways. The electronic element is then placed into this pre-prepared structure, allowing for standardized positioning and connection processes. This preliminary formation of the package structure reduces the precision requirements compared to attempting to embed elements into pre-formed rigid circuits.
Solution Approach 2:
The package structure serves as an intermediary between the electronic element and the external environment, providing a controlled interface for electrical connections. The circuit structure layer acts as an intermediate conductive layer that facilitates reliable electrical connectivity while accommodating manufacturing tolerances through its flexible routing capabilities.
Data Source
AI summary
An electronic device is provided. The electronic device includes a circuit structure layer, a package structure, and an electronic element. The circuit structure layer includes a circuit layer and a plurality of first conductive pads. The package structure is disposed on the circuit structure layer. The electronic element is embedded in the package structure. The electronic element is electrically connected to the circuit layer through the plurality of first conductive pads. A thickness of the package structure is greater than or equal to 1.5 times a thickness of the electronic element.