Embedded Semiconductor Package Cavity for Compact Reliable Interconnects
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Solution Overview
Problem
Conventional semiconductor packages face issues of high cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
The development of a semiconductor device manufacturing method involving a redistribution layer (RDL) substrate with a dielectric and conductive structure, coupled with an electronic component, and an internal interconnect, which allows for efficient electrical coupling and protection of the component, along with a method of singulating the device to reduce size and enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packaging methods are used, then manufacturing cost is reduced, but reliability decreases and package size increases
Solution Approach 1:
The patent embeds the electronic component within a cavity formed in the package substrate, creating a nested structure where the component is housed inside the package body rather than mounted on the surface. This nesting approach reduces the overall package footprint while maintaining reliability through proper component protection and electrical connection.
Solution Approach 2:
The patent transitions from traditional surface-mount packaging to a three-dimensional configuration by forming a cavity within the substrate and placing the component inside. This dimensional change allows for more efficient space utilization, reducing package size while maintaining or improving reliability through better thermal and electrical management in the vertical dimension.
2Ease of manufacture
If conventional semiconductor packaging methods are used, then manufacturing simplicity is maintained, but cost increases and performance decreases
Solution Approach 1:
The patent divides the manufacturing process into distinct stages: forming the cavity in the substrate, preparing the component with appropriate interconnects, and assembling them together. This segmentation allows for standardization of each step, improving manufacturing efficiency and reducing costs through process optimization and automation potential.
Solution Approach 2:
The cavity is formed in the package substrate before component assembly, and the component is prepared with appropriate interconnect structures in advance. These preliminary actions enable more efficient final assembly, reducing overall manufacturing complexity and cost while improving performance through better-prepared interfaces.
3Reliability
If conventional semiconductor packaging methods are used, then package size is maintained, but reliability decreases and performance is suboptimal
Solution Approach 1:
By nesting the component within a cavity in the substrate, the patent achieves improved reliability through better mechanical support, thermal management, and electrical connection while actually simplifying the overall structure compared to traditional multi-layer interconnect approaches. The nested configuration reduces the number of external connections and interfacial complexity.
Data Source
AI summary
In one example, a semiconductor device comprises a first substrate comprising a first conductive structure, a first body over the first conductive structure and comprising an inner sidewall defining a cavity in the first body, a first interface dielectric over the first body, and a first internal interconnect in the first body and the first interface dielectric, and coupled with the first conductive structure. The semiconductor device further comprises a second substrate over the first substrate and comprising a second interface dielectric, a second body over the second interface dielectric, and a second conductive structure over the second body and comprising a second internal interconnect in the second body and the second interface dielectric. An electronic component is in the cavity, and the second internal interconnect is coupled with the first internal interconnect. Other examples and related methods are also disclosed herein.