Embedded Component Package Bonding with Dual-Sided Dielectric Curing
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Solution Overview
Problem
Existing embedded component package structures face challenges in ensuring reliable bonding and package processes, leading to inadequate adhesion forces and susceptibility to component detachment during subsequent processing steps.
Innovation Solution
A manufacturing method for an embedded component package structure involves providing a carrier with a semi-cured first dielectric layer, placing a component on it, and applying heat from both the top and bottom to cure the dielectric layer. This method enhances the bonding process by increasing the covering height of the dielectric layer around the component, ensuring secure fixation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a component is embedded in a package substrate, then the product size is reduced and noise interference is reduced, but the bonding reliability may be insufficient leading to component detachment
Solution Approach 1:
The patent divides the bonding process into two distinct stages: a first bonding stage where the component is initially attached to the package substrate, and a second bonding stage where additional bonding is performed to enhance adhesion. This segmentation allows each stage to optimize for different requirements, ensuring both compact embedding and reliable bonding.
Solution Approach 2:
The patent performs a preliminary bonding action before final component embedding. The first bonding stage prepares the component-substrate interface in advance, creating initial adhesion that is then strengthened in the second bonding stage, preventing detachment during subsequent processing.
2Device complexity
If heat energy is applied from only one side to cure the dielectric layer, then the process is simpler, but the curing uniformity and bonding reliability are insufficient
Solution Approach 1:
The patent employs asymmetric heating by applying heat energy from both the first side and the second side of the package substrate simultaneously. This dual-sided asymmetric approach ensures uniform heat distribution through the substrate and dielectric layer, achieving consistent curing and reliable bonding without excessive process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed method significantly enhances the reliability of the package process by achieving stable and secure bonding of the component to the dielectric layer, reducing the likelihood of detachment and ensuring successful lamination and wire patterning processes.
Implementation Method 1
respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer
Data Source
AI summary
A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.