Embedded Electronic Package Layout for Multi-Chip Heat Isolation
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Solution Overview
Problem
Conventional semiconductor packages face overheating issues due to heat accumulation from high computing function chips, which can affect the operation of other integrated chips within the same packaging layer.
Innovation Solution
The electronic package incorporates a circuit structure with a heat dissipation portion thermally connected to the first electronic element, featuring insulating and conductive blind vias, and heat dissipation pillars or layers to efficiently dissipate heat away from the packaging layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor chips with different functions are integrated in the same packaging layer, then the computing ability and I/O capacity are greatly increased, but heat accumulates in the packaging layer causing overheating that affects the operation of other chips
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional packaging structure by introducing a dedicated heat dissipation layer between the packaging layer and the substrate. This heat dissipation layer selectively removes heat from the packaging layer without interfering with the electrical connections or the functional integration of multiple chips, thereby resolving the overheating problem while maintaining high computing ability
Solution Approach 2:
The heat dissipation layer acts as an intermediary component between the packaging layer and the substrate. It mediates the thermal interaction by absorbing and dissipating heat generated by high-performance chips, preventing heat accumulation in the packaging layer while allowing the integrated chips to continue operating at high performance levels
2Temperature
If a heat dissipation structure is added to cool the packaging layer, then the temperature is reduced, but the device complexity increases
Solution Approach 1:
The heat dissipation layer is designed to perform multiple functions simultaneously: it provides thermal management by dissipating heat from the packaging layer, while also serving as part of the overall packaging structure. This multi-functionality reduces the need for additional separate cooling components, thereby limiting the increase in device complexity while achieving effective temperature control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat generated by high computing function chips, preventing overheating and ensuring the reliable operation of adjacent chips by quickly removing heat energy from the packaging layer.
Implementation Method 1
a circuit structure disposed on the packaging layer and electrically connected to the first electronic element and the second electronic element, wherein the circuit structure has a heat dissipation portion thermally connected to the first electronic element
Data Source
AI summary
An electronic package and a manufacturing method thereof are provided, in which a first electronic element and a second electronic element are embedded in a packaging layer, and a circuit structure is formed on the packaging layer and electrically connected to the first electronic element and the second electronic element, where the circuit structure has a heat dissipation portion thermally connected to the first electronic element. Therefore, the heat energy generated by the first electronic element can be quickly dissipated to the outside via the heat dissipation portion, so as to avoid the problem of affecting the operation of the second electronic element due to overheating of the packaging layer.