Embedded Buildup-Layer Inductor Structure for High-Density Package Power

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Solution Overview

Problem

Existing inductor structures in package substrates face limitations such as space constraints, increased package size, and additional losses due to low μr magnetic materials and distance from the die, particularly in plated through hole architectures.

Innovation Solution

Incorporation of cold spray technology to manufacture magnetic inductors within package buildup layers, allowing for high μr magnetic materials and high inductance density, using a cold spray process to create inductors that can be embedded in the package substrate, enabling high inductance at minimal size and integrating with the power delivery network.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If plated through hole architecture is used for magnetic inductors, then inductors can be provided in server packages, but only relatively low μr magnetic materials can be used and package core must be thick enough

Engineering Contradiction:

Improveinductor performanceVSAvoidpackage core thickness

Core Design Contradiction:

ReliabilityVSLength of moving object

Solution Approach 1:

The patent transitions from traditional plated through hole inductors (vertical dimension) to buildup layer inductors (horizontal dimension within the package substrate). This allows high μr magnetic materials to be used without requiring thick package cores, as the inductors are formed within the buildup layers using magnetic paste and conductive paste patterns.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent changes the magnetic material parameter by using high μr magnetic materials in the buildup layer configuration, which were not suitable for plated through hole architecture. This parameter change enables higher inductance density while maintaining compatibility with standard package core thicknesses.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If land side or die side magnetic inductors are used, then inductors can be provided on the package, but package size must be grown and additional inductor losses occur

Engineering Contradiction:

Improveinductor functionalityVSAvoidpackage area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges the inductor function with the existing buildup layer structure of the package substrate. By forming inductors within the buildup layers using magnetic and conductive pastes, the design combines multiple functions (structural support, power delivery, and inductance) into a single integrated architecture, eliminating the need for separate land side or die side inductor placements.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent moves inductors from the traditional land side/die side positions (surface mounting) to within the buildup layers (embedded configuration). This dimensional transition reduces the occupied package area while maintaining inductor functionality, as the inductors are distributed within the substrate layers rather than occupying surface real estate.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If land side or die side magnetic inductors are used, then inductors can be provided on the package, but distance to die increases causing additional losses

Engineering Contradiction:

Improveinductor operationVSAvoidinductor losses

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The patent positions the inductors within the buildup layers in close proximity to the die during the manufacturing process, before final assembly. This preliminary positioning ensures minimal distance between the inductors and the die, reducing energy losses from magnetic field coupling inefficiencies and improving overall system performance.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides higher inductance densities and quality factors, reduces inductor losses, and allows for integration in various products beyond server packages by utilizing high μr magnetic materials within the package buildup layers.

Implementation Method 1

cold spray inductor structure... at least one of the electrically conductive body or the magnetic structure has a granular microstructure including randomly distributed particles presenting substantially non-linear particle-to-particle boundaries with one another

Methodology Applied

Scientific EffectCold spray:

Data Source

PatentUS12520506B2In situ inductor structure in buildup power planes

Publication Date: 2026.01.06 INTEL CORP

AI summary

An inductor structure, a package substrate, an integrated circuit device, an integrated circuit device assembly and a method of fabricating the inductor structure. The inductor structure includes: an electrically conductive body; and a magnetic structure including a non-electrically-conductive magnetic material, wherein: one of the magnetic structure or the electrically conductive body wraps around another one of the magnetic structure or the electrically conductive body to form the inductor structure therewith; and at least one of the electrically conductive body or the magnetic structure has a granular microstructure including randomly distributed particles presenting substantially non-linear particle-to-particle boundaries with one another.