Embedded Component Package Lamination With Dual-Side Heat Curing
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Solution Overview
Problem
In embedded component package structures, existing bonding methods face challenges with insufficient adhesion and inadequate coverage of the dielectric layer, leading to potential detachment of the component during subsequent processing steps due to warpage and high curing speeds.
Innovation Solution
A manufacturing method involving a semi-cured first dielectric layer on a carrier, where heat energies are applied from both top and bottom to cure the layer, ensuring stable bonding and increased coverage height, mitigating warpage and enhancing adhesion forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a semi-cured first dielectric layer is used for component bonding, then adhesion and coverage are improved, but curing speed increases causing warpage
Solution Approach 1:
The patent applies dual-side heating to change the temperature distribution parameter, heating both the top and bottom surfaces simultaneously to achieve uniform curing throughout the dielectric layer. This prevents warpage caused by uneven thermal expansion and curing stress while maintaining the semi-cured state's adhesion benefits
Solution Approach 2:
The curing process uses controlled periodic heating cycles with specific temperature profiles. The heating is applied in stages with controlled duration and intensity, allowing the dielectric layer to cure uniformly without excessive warpage while achieving the required adhesion strength
2Productivity
If high curing speed is applied to the dielectric layer, then productivity is improved, but adhesion reliability deteriorates due to insufficient coverage
Solution Approach 1:
The patent transitions from single-side heating to dual-side heating, adding a second heating dimension. This allows simultaneous curing from both top and bottom surfaces, effectively doubling the curing speed while maintaining uniform adhesion coverage across the entire dielectric layer
3Reliability
If the first dielectric layer covering height is increased to prevent detachment, then component security is improved, but manufacturing complexity increases
Solution Approach 1:
The dual-side heating system enables the dielectric layer to self-cure uniformly throughout its thickness, achieving adequate covering height and adhesion without requiring additional manual intervention or complex multi-step processing. The uniform thermal field automatically ensures consistent curing from bottom to top
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method provides enhanced reliability by ensuring secure fixation of the component with improved adhesion and coverage, preventing detachment and facilitating successful lamination and wire patterning processes.
Implementation Method 1
providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer
Data Source
AI summary
A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.