Embedded Package in PCB Buildup for Thinner Mobile Devices
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Solution Overview
Problem
The thickness of mobile and handheld devices is limited by the size of the motherboard, which restricts the overall device thickness, particularly in mobile personal computers and notebooks, due to the physical constraints of conventional printed circuit boards.
Innovation Solution
The implementation of a high-density interconnect (HDI) printed circuit board process using buildup layers and laser-drilled microvias reduces the board size and z-height by embedding electronic components, such as microprocessors, within the circuit board, eliminating the need for surface connections and allowing for thinner form factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional printed circuit board structures are used with surface-mounted components, then ease of manufacture is maintained, but the z-height and overall device thickness increase
Solution Approach 1:
The patent transitions from conventional surface-mounted component arrangement to embedded components within the board structure, utilizing the Z-dimension (vertical embedding) to reduce the overall z-height. Buildup layers are formed around and over embedded components, effectively moving the component placement from a 2D surface to a 3D embedded space, thereby reducing the vertical profile of the device.
Solution Approach 2:
Components are nested within the printed circuit board structure itself. The board structure contains embedded components (such as microprocessors) within its internal volume, surrounded by buildup layers. This nesting approach eliminates the need for separate component mounting surfaces and reduces the overall z-height by integrating components into the board's internal architecture.
2Length of moving object
If components are embedded within the circuit board using buildup layers, then the z-height is reduced, but the manufacturing process complexity increases
Solution Approach 1:
Components are embedded into the board structure during the buildup process itself, before final board assembly. The method involves forming openings in the substrate, placing components within these openings, and then forming buildup layers around them in a controlled sequence. This preliminary embedding action simplifies subsequent manufacturing steps by eliminating the need for post-assembly component mounting and reduces the overall z-height.
3Productivity
If high-density interconnect structures with laser-drilled microvias are used, then signal density and routing capability improve, but manufacturing precision requirements increase
Solution Approach 1:
The patent replaces conventional mechanical drilling methods with laser drilling for creating microvias. The laser drilling process offers superior precision and control compared to mechanical drilling, enabling the creation of smaller, more precise microvias with tighter tolerances. This substitution allows for higher signal density and more complex routing patterns while maintaining manufacturing feasibility through the precision and consistency of laser processing.
Data Source
AI summary
An apparatus including a printed circuit board including a body of a plurality of alternating layers of conductive material and insulating material; and a package including a die disposed within the body of the printed circuit board. A method including forming a printed circuit board including a core and a build-up section including alternating layers of conductive material and insulating material coupled to the core; and coupling a package including a die to the core of the printed circuit board such that at least a portion of a sidewall of the package is embedded in at least a portion of the build-up section. An apparatus including a printed circuit board including a body; a computing device including a package including a microprocessor disposed within the body of the printed circuit board; and a peripheral device that provides input or output to the computing device.