Embedded Semiconductor Package with Pre-formed Conductive Pillars
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Solution Overview
Problem
The manufacturing process of embedded semiconductor packages is complex, leading to low product yield and high costs due to the need for prepreg lamination and laser drilling for through-via structures or redistribution layers (RDLs).
Innovation Solution
A semiconductor package structure featuring a conductive base, semiconductor die, and conductive pillars surrounded by an encapsulant, where the conductive pillars are formed before encapsulation, eliminating the need for costly through-via structures or RDLs, and using a molding process for encapsulant formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-via structures or redistribution layers (RDLs) are used in embedded semiconductor packages, then electrical transmission performance is improved, but manufacturing complexity increases and product yield decreases
Solution Approach 1:
The conductive pillars are formed before the encapsulant is applied, establishing the electrical transmission path in advance. This preliminary formation of conductive structures eliminates the need for subsequent complex through-via drilling or RDL formation steps, thereby maintaining electrical performance while simplifying the overall manufacturing process
Solution Approach 2:
The patent extracts and eliminates the complex through-via and RDL structures from the manufacturing process by using pre-formed conductive pillars that are directly embedded in the encapsulant. This removal of unnecessary intermediate structures reduces manufacturing complexity while preserving the essential electrical transmission function
2Reliability
If through-via structures or redistribution layers (RDLs) are used in embedded semiconductor packages, then electrical transmission performance is improved, but manufacturing cost increases
Solution Approach 1:
The conductive pillars are formed as simple, cost-effective structures using basic semiconductor fabrication techniques rather than expensive laser drilling or multiple lamination steps. These pillars serve their purpose effectively as part of the encapsulation process, reducing overall manufacturing costs while maintaining electrical performance
3Reliability
If known good dies are used during assembly, then product quality is improved, but risk of damage during complex assembly processes increases
Solution Approach 1:
The conductive pillars and their electrical connections are prepared in advance before the known good dies are attached to the substrate. This preliminary preparation of the electrical transmission path simplifies the assembly process, reducing handling steps and minimizing the risk of damaging valuable known good dies during assembly
Data Source
AI summary
A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a conductive base, a first semiconductor die, a first conductive pillar, and a first encapsulant. The conductive base has a first surface. The first semiconductor die is disposed on the first surface of the conductive base. The first conductive pillar is disposed on the first semiconductor die. The first encapsulant is disposed on the first surface of the conductive base. The first encapsulant encapsulates the first semiconductor die. The first encapsulant includes an opening defined by the first conductive pillar.