Embedded Package Shielding via Core Layer Integration
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Solution Overview
Problem
Semiconductor devices with smaller sizes suffer from increased electromagnetic interference (EMI) due to higher processing speeds and densities, and existing shielding solutions like conductive casings are cumbersome, increasing production costs and package volume, and are not suitable for high-density embedded electronic device packages.
Innovation Solution
An embedded electronic device package structure with a core layer, dielectric layers, a shielding metal layer, and conductive vias that extend from the dielectric layers to the shielding metal layer, providing both electrical connection and electromagnetic shielding without the need for an external shielding cover, utilizing prepreg and laser vias for efficient integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conductive casing is used for electromagnetic shielding, then EMI is reduced, but package volume increases and production cost increases
Solution Approach 1:
The patent merges the shielding function with the existing core layer structure by forming a conductive shielding layer directly on the inner surface of the core layer. This integration eliminates the need for a separate external conductive casing, thereby reducing package volume while maintaining EMI shielding effectiveness. The shielding layer is combined with the core layer's cavity structure, creating a compact embedded design.
Solution Approach 2:
The patent transitions from a three-dimensional external casing structure to a two-dimensional surface layer integrated on the core layer. The shielding metal layer is formed as a thin film on the inner surface of the core layer, reducing the volume requirement from a bulky external casing to a planar integrated layer, thus achieving EMI shielding without increasing package volume.
2Object-affected harmful factors
If a conductive casing is used for electromagnetic shielding, then EMI is reduced, but production cost increases
Solution Approach 1:
The patent combines the shielding function with the existing core layer manufacturing process. The conductive shielding layer is formed using standard PCB fabrication techniques (deposition, etching, plating) that are already part of the core layer production. This integration eliminates the need for separate casing manufacturing and assembly operations, thereby reducing production cost while maintaining EMI shielding effectiveness.
Solution Approach 2:
The core layer structure serves multiple functions: it provides mechanical support, electrical connection pathways, and electromagnetic shielding. The shielding metal layer on the core layer's inner surface performs both structural and EMI shielding functions simultaneously, eliminating the need for a dedicated external casing and reducing overall production complexity and cost.
3Object-affected harmful factors
If a conductive casing is used for electromagnetic shielding, then EMI is reduced, but the package structure becomes more complex
Solution Approach 1:
The patent merges the shielding function into the existing core layer structure, eliminating the need for a separate external casing component. The shielding layer is integrated directly on the core layer's inner surface, reducing the number of discrete parts and simplifying the overall package structure while maintaining EMI shielding effectiveness.
Solution Approach 2:
The core layer structure provides its own shielding capability through the conductive metal layer formed on its inner surface. This self-service approach eliminates the need for external shielding components and complex assembly operations, simplifying the package structure while achieving EMI protection.
4Ease of manufacture
If adhesive paste is used to fix the conductive casing, then the casing can be attached, but reliability decreases due to temperature and humidity
Solution Approach 1:
The patent merges the shielding layer formation with the core layer manufacturing process using standard PCB techniques. The conductive shielding layer is deposited and etched directly on the core layer's inner surface, creating a permanent integral structure. This eliminates the need for adhesive paste attachment and associated reliability issues with temperature and humidity, while maintaining secure attachment of the shielding function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces package volume, simplifies manufacturing, and saves production costs by leveraging existing space for electromagnetic shielding, effectively mitigating EMI without the need for additional shielding covers, making it suitable for high-density electronic devices.
Implementation Method 1
by disposing grounding conductive casing or conductive housing at the outside of the package structure, shielding effect is achieved. When the electromagnetic emission radiating from the inside of the package structure toward the inner surface of the casing, at least part of the electromagnetic emission is shorted, so as to diminish the strength of the electromagnetic emission which is capable of penetrating the casing
Data Source
AI summary
An embedded-electronic-device package includes a core layer, an electronic device, a first dielectric layer, a second dielectric layer, a shielding-metal layer and conductive vias. The core layer includes a first surface, a second surface opposite to the second surface and a cavity penetrating the core layer. The electronic device is disposed in the cavity including an inner surface. The first dielectric layer disposed on the first surface is filled in part of the cavity and covers part of the electronic device. The second dielectric layer disposed on the second surface is filled in rest of the cavity, covers rest of the electronic device. The first and second dielectric layers cover the electronic device. The shielding-metal layer covers the inner surface. The conductive vias are respectively disposed in the first and second dielectric layers and extended respectively from outer surfaces of the first and second dielectric layers to the shielding-metal layer.